Wafer Manufacturing System

Variety of products line for wafer manufacturers including Sliced Wafer Demounting and Cleaning Machine and Wafer Edge Grinding Machine.

Sliced Wafer Demounting and Cleaning Machine: C-RW-200/300
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
Wafer Edge Grinding Machine: W-GM-6200
Edge Grinder for Forefront 450 mm Wafer.
Catalog PDF(427.2KB)
Wafer Edge Grinding Machine: W-GM-5200
Top Share in 300 mm Si Market.
Catalog PDF(361.8KB)
Wafer Edge Grinding Machine: W-GM-4200
Capable of Grinding Various Material & Wafer Size.
Catalog PDF(319.6KB)

About Semiconductor Manufacturing Equipment