Semiconductor Manufacturing Equipment
UF2000
Φ200mm
Discrete Device
Power Device
Logic Device
MEMS
High-performance probing machine for 200mm wafer

UF2000

Most significant machine model for 200mm wafers
High precision, high rigidity machine.

Feature

Improved high rigidity and high speed operation technology contribute to the better precision and throughput.

Variety of options enables all kinds of wafer tests that are not standard in this industry.

Option

Testing environment to adopt from ultrahigh to low temperature

Hinge-type manipulator for test-head

Transfer of warpage and ultrathin wafer by the special transfer mechanism

FFU to realize clean testing environment

Low noise testing environment

High-voltage testing environment

Wide variety of network environment

Needle track inspecting function