Next-generation ultra-high-performance probing machine designed to achieve high precision, high throughput, low vibration and low noise.
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300mm Framed wafer & CSP handling machine. -
It is the prober with high-speed probing that targets non-memory device. -
Most significant machine model for 200mm wafers
High precision, high rigidity machine. -
Highly efficient, High throughput, wafer & CSP handling machine.
Better cost performance machine. -
High-speed machine for discrete. -
200mm Framed wafer & CSP handling machine -
Accretech Probing Machine for full wafer testing on a single touch down. Developed with capability to simultaneously measure on 12 stages with dedicate XY stage and POGO tower. -
Consolidated management of the operation of probing machines for higher operation rate. -
This network allows you to consolidate the management of resources with the user host. -
The GEM Network System supports standards based on the SEMI standards to achieve factory automation at customers. -
This is a group of dedicated terminals for increasing the efficiency of test areas.
