Semiconductor Manufacturing Equipment
FP2000
Φ200mm
Frame
Diced Wafer
MEMS
Probing machine for 200 mm framed wafers

FP2000

High precision model for the 200 mm wafers
Supporting CSP/WLCSP devices that is affixed on dicing frames.

Feature

It performs the precision measurement using our unique correction technology on cut wafer, package and such that are attached to the dicing frame.

It is the multi-functional prober which perfoms transfer and testing on a frame as well as wafer of 5 to 8 inches with only one click of button.

Optimization of correction value is realized by the application software which is the outcome of the well-accumulated experiences of 15 years since the release of the frame transfer prober.

Option

Multiple barcode management

Hinge-type manipulator for test-head

High-temperature testing environment

Needle track inspecting function

Adopts 6 inch frame