Feature
The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames.
Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.
All the processes are completed without moving the wafer on the same chuck table.
The smallest footprint in the world.
Environmental - friendly - subsurface damage reduction without chemicals.
System configuration
