Semiconductor Manufacturing Equipment

With the diamond, the world-hardest substance, super-abrasive grit,we offer the cutting blade and solution that are high quality and cost cutting.

Probing machines perform electrical tests of each chip on a wafer, ensuring the quality of semiconductor devices.

Polish grinders simultaneously thin wafers while performing damage removal caused by the grinding process, and offer various applications for peripheral processes in the one system.

High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials

CMPs remove unevenness on wafer surfaces that occur during the production process.
Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.

Highly accurate wafer edge grinding Machine for φ50 mm to 200 mm, 300 mm, and 450 mm wafer production. It is used in production lines of all over the world.

Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw