Semiconductor Manufacturing Equipment
HRG3000RMX
Φ300mm
Φ200mm
Fully Automatic High Rigid 3-Axis Grinder

HRG3000RMX

It realizes ultra-thinning processing at high speed and high precision, and thus contributes to a wide range of thinning processes in the entire semiconductor process.

Feature

Less-damage Grinding with Shorter Process Time

Low processing cost

High Accuracy

Mirror Finish Surface Grinding