Feature
The structure with the little mechanical transformation against the workload of grinding is realized by placing the processing position on the center positon of the slide guides placed in a triangle form and the infeed shaft on the processing position
Due to the high-rigidity, it enables the processing with shorter amount of time while reducing the grinding damage
Due to the high-rigidity, it enables the processing of the appropriate self-sharpening. It prolongs the life of the grindstone
It is equipped with the in-process gauge that is batch processing-compliant, and performs the processing while measuring the wafer thickness in the batch processing
It detects the clogging of the grindstone and performs the dressing as necessary
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