Top Share in 300 mm Si Market.


  • Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.
  • The non-contact measuring method achieves the stable alignment.
  • Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.
  • The modular concept to make the optimum process line possible.
  • Low damage grinding method is available.
  • Machine specification ready for 300 mm wafer.
  • Visual system (optional) for measuring the chamfer width of periphery and notch.

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