W-GM-4200

Capable of Grinding Various Material & Wafer Size

Feature

  • Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness
  • The non-contact measuring method achieves the stable alignment
  • Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer
  • The modular concept to make the optimum process line possible
  • Low damage grinding method is available, Mirror Finish
  • Machine specification ready for 2" to 6" wafer or for 4" to 8" wafer
  • Capable of various material processes, such as chemical compound semiconductor(Si,SiC,GaN,GaAs,LT,Sapphire,etc...)

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