SS10

The standard specification completely supports high-precision dicing. Speeding up the X, Y, Z axes contributes to enhanced throughput. A 1.8 kW rating, high-output spindle is equipped as standard. A wide range of materials are supported, from silicon to difficult-to-cut materials.

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Features

Compact design, φ150mm wafer compatible dicing machine
A wide range of materials are supported, from silicon to difficult-to-cut materials.
The design aimed at narrowing the width greatly contributes to the enhanced productivity per unit area in the case that several units of equipment are lined up.

High-performance, high-output spindle equipped as standard
Rating of 1.8 kW, maximum rotation speed 60 krpm (a 2.2 kW rating, high-torque spindle can also be equipped as an option)

Enhanced productivity (throughput)
Gate type structure + servomotorization of the X, Y, Z axes
Both a reduced footprint and high throughput are established

Operability
A 17-inch touch panel + GUI (Graphical User Interface) are used.
Simply by touching the iconized buttons, straightforward and comfortable operation is achieved.
The device is equipped with an operation system in common with the AD/SS Series whose use is familiar.

Specifications

Maximum work size	Φ 150 mm
Spindle Layout	Single spindle
Spindle Rating	1.8 kW
Spindle Highest number of rotations	60,000 rpm
X axis Send speed entry range	0.1-300 mm/sec
X axis Return speed	750 mm/sec
Y axis Resolution	0.0001 mm
Y axis Positioning precision	0.002 mm/162　mm
Y axis Repeatability	0.001 mm
Z axis Standard compatible blade diameter	Φ 48-Φ 60 mm
Specifications Dimensions（W x D x H）	495 mm×880 mm×1,715 mm
Specifications Weight	389 kg