Dicing Machines

12-inchi Fully Automatic Dicing Machine
Automatic switchover between wafer handling and frame handling contributes to reduction of switchover risk and downtime

8-inchi Fully Automatic Dicing Machine
Achieved smallest footprint possible utilizing our own core technology

8-inchi Semi-Automatic Dicing Machine
Revolutionary axis design orientation creates the smallest twin spindle Dicing Saw

6-inchi Semi-Automatic Dicing Machine
Improved operability with the 17-inch touch panel screen
The image-processing engine accommodates variety of work

8-inchi Semi-Automatic Dicing Machine
Small footprint with highly stable structure
Compliant with the large work

12-inchi Semi-Automatic Dicing Machine
Small footprint with highly stable structure
Compliant with varieties of work

Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible! New connected handlers, shorten coordination time - bringing increased operation efficiency and substantial savings in processing time

12-inch laser dicing machine with wafer handling system and visible light microscope.

Production and sales of ML300 series ​was finished.

Stand-alone wafer cleaning unit, A-CS-300 provides best solution for cleaning and drying the wafer cut by semi-automatic dicing saws. Air accelerated water nozzle and horizontal swing arm achieves excellent cleaning quality

Achieves both high quality processing and high throughput with a unique laser engine mechanism