Semiconductor Manufacturing Equipment
AD3000T-PLUS
Fully Automatic
Blade
Φ300mm
Semiconductors
Twin Spindle
Fully automatic dicing machine for Φ300mm wafers

AD3000T-PLUS

The opposing type 2-axis spindles are arranged diagonally, to achieve both a reduced space design and high maintainability.
All daily operations such as blade replacement and maintenance work can be performed using front access from the front of the device. Access from the side is not necessary, so equipment layout is possible with small gaps. This contributes to labor-saving in clean rooms.

Features

Reduced space design

・Reduced space design

This is an originally developed diagonal layout design. Everything from normal operation to maintenance is accessible from the front. 
When multiple units are installed in a line, since the lateral surface maintenance area can be reduced, 5 units of the AD3000T-PLUS can be installed in the installation space for 4 units of the conventional devices. 

Enhanced productivity (throughput)

・Enhanced productivity (throughput)

Waste-free processing is achieved with an opposing type 2-axis spindle design and the minimum required X movement.
X axis speed: 1,000 mm/sec, Y axis speed:  300 mm/sec, Z axis speed: 80 mm/sec
Servomotors are used for all the X, Y, Z axes to speed up the axis speed
A reduction in processing time is achieved through optimization of the control software + synchronous control of the 3 axes
Two optical cutter-set (common name: OPC) units are mounted as standard. Reduction of the standby time by simultaneous set-up

・High-performance, high-output spindle equipped as standard

1.8 kW rating, maximum rotation speed of 60 krpm (a 2.2 kW rating, high-torque spindle can also be mounted as an option)
Processing of a wide range of materials is supported, from silicon to difficult-to-cut materials. 

Operability

・Operability

A 17-inch touch panel + GUI (Graphical User Interface) are used. 
Simply by touching the iconized buttons, straightforward and comfortable operation is achieved. 

・Plenty of optional settings

Intermediate dress feature, built-in UV irradiation system, barcode reader automatic recipe switching feature, ionizer, etc.
The major optional units can be built-in due to the smaller footprint of the optional units and the optimized internal design

・Over 10000 recipes storable in the HDD

・USB port equipped as standard

(USB memory can be used as an external memory device)

・An echo function equipped as standard

With the optimization of the vacuum control, the amount of air consumption is reduced by 50% or more compared to our conventional devices.

Specifications

Maximum work size Φ 305 mm
Maximum supported frame 12 inch (SEMI G74-0699)
Spindle Number of rotations 60,000 rpm
Maximum blade diameter Φ 60 mm (2-Inch)
Φ 80 mm (3-Inch) (option supported)
Rating output 1.8 KW
X axis Cuttable range 310 mm
Fastest speed 1,000 mm/s
Y1/Y2 axis Cuttable range 310 mm
Fastest speed 300 mm/s
Control resolution 0.078 µm
Cumulative precision 0.002 mm / 310 mm
Z1/Z2 axis Stroke 35 mm
Resolution 0.002 µm
Fastest speed 80 mm/sec
Repeatability 0.001 mm
Θ axis Rotation range 380°
Specifications Voltage 3 Phase AC200 to 220 V ±10%
(Other than the above, compatible with a transformer)
Consumed electric power 6.0 kVA (MAX)
Air supply pressure 0.55 to 0.7 MPa
Average consumed volume of air 210 L/min (at 0.55 MPa)
Average consumed volume of clean air 140 L/min
Supply water pressure (cutting water, other) 0.3 to 0.5 MPa
Supply water
Maximum flow rate
Cutting water: 10.0 L/min
Water curtain: 3.0 L/min
Other: 0.6 L/min
Cooling water pressure 0.3 to 0.5 MPa
Cooling water flow rate 3.4 L/min (at 0.3 MPa)
Exhaust flow rate 5.0 m³/min or greater
Dimensions (W x D x H) 1,290 mm x 1,530 mm x 1,900 mm
Weight 1,360 kg

Automatic Blade Replacement Feature (Optional)

ABES (Auto Blade Exchange System)
In recent years, as part of factory automation, the introduction of automation into semiconductor back-end processing is progressing. The Φ 300 mm line in particular, from the viewpoint of them being unmanned and highly efficient, has an increase in activity to introduce automation. And, in the AD3000T-PLUS, in order to meet those demands, it is now possible to mount an automatic blade replacement system (Auto Blade Exchange System: ABES). In this system, the end of life of the HUB blade is automatically detected, from the HUB blade replacement to the return to processing is completely automated, and so the equipment downtime is minimized. In addition, depending on the individual operation status, the flange condition control feature, and the automatic adjustment feature of the blade damage detector can be mounted as options. 

ABES(Auto Blade Exchange System)

Maintenance

Maintenance

The maintainability is improved through the large door and large processing room.