Semiconductor Manufacturing Equipment
AD20T/S
Semi-Automatic
Blade
Φ200mm
Electronic Components
Single/Twin Spindle
Semiconductors
Semi-automatic dicing machine for Φ200mm wafers

AD20T/S*

*Spindle mounted specification T (Twin): opposing type 2-axis spindle specification, S (Single): 1-axis spindle specification
Opposing type 2-axis spindle equipped Φ 200 mm wafer compatible semi-automatic blade dicing machine
The step cut mode provides high processing quality. The productivity-focused processing dual processing mode is supported through the 1-pass full cut.

Features

The industry’s smallest class ,Φ 200 mm wafer-compatible, 2-axis spindle-equipped semi-automatic dicing machine
In the semi-automatic dicer market, 1-axis spindle machines are spreading widely in general, but taking the initiative in the industry, the 2-axis spindle-equipped semi-automatic dicer has been developed*1 and launched in the market.

*1 Released in September 2009, based on in-house research

Meets a variety of processing demands
High processing quality through the step cut mode. The productivity-focused processing dual processing mode is supported through the 1-pass full cut, and a broad range of device processing is supported from silicon to electronic components. 

Enhanced productivity (throughput)
Gate type structure + servomotorization of the X, Y, Z axes 
Both a reduced footprint and high throughput are established. 
Cutting quality is improved with the new design due to high rigidity and low vibration. 

Operability
A 17-inch touch panel + GUI (Graphical User Interface) are used. 
The device is easily and comfortably operated simply by pressing the buttons with icons on. 
The device is equipped with the same operation system as the AD/SS Series whose use is familiar.

Specifications

Maximum work size (mm) Φ200 mm
Spindle Layout T(TWIN):Opposing 2-axis spindle
S(Single):1-axis spindle
Rating 1.8 kW
Highest number of rotations 60000 rpm
X axis Send speed entry range 0.1-400 mm/sec
X axis Return speed 800 mm/sec
Y axis Resolution 0.078 μm
Y axis Positioning precision 0.002 mm/260 mm
Z axis Repeatability 0.001 mm
Z axis Standard compatible blade diameter Φ48-60mm
Specifications Dimensions (W x D x H) 790 mm×790 mm×1900 mm
Specifications Weight 1100 kg