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CMP

CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.

  • ChaMP: For 300 mm Wafers
    ChaMP: For 300 mm Wafers
    Fusing the acquired technology of precision measuring instrument and semiconductor manufacturing equipment, Accretech fully meets the process performance required in advanced devices, and proposes CMP systems (ChaMP series) for 300 mm wafer responded to the demand from volume-production plant.
    Catalog PDF(539.6KB)
  • ChaMP: Compact CMP System
    ChaMP: Compact CMP System
    Compact CMP systems with high performance CMP technology built up in volume-production line of semiconductor device.
    Catalog PDF(539.4KB)

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