ChaMP: Compact CMP System
Compact CMP systems with high performance CMP technology built up in volume-production line of semiconductor device.
Feature
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Reasonable initial cost
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Small footprint
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High-performance CMP → Know-how from mass production
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Flexible Customization up to user’s requirement → From R&D, trial production to mass production
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2”～8” polishing head available, multiple size of wafers are polishable in one system.
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Mounting of wafer loader enables full-automatic operation
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Mounting of cleaning unit enables precise cleaning
Air-float Head "Sylphide"
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Air film formation provides very uniform pressure distribution in the wafer plane
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Possession of an airbag independent of an air film provides low-pressure stability
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An independent retainer pressure airbag provides excellent edge profile control
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One-touch replacement of retainer/membrane reduces downtime (see below)
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Addition of zone control function is available (optional)
Optical End-Point Detection System
Uses white light source and accurately detects residual film changes with reflection data of wide wavelength range and special algorithm.
Sylphide
Provides a wide range of applications
Various optional functions for mass production are available
