Feature
Reasonable initial cost
Small footprint
High-performance CMP → Know-how from mass production
Flexible Customization up to user’s requirement → From R&D, trial production to mass production
2”～8” polishing head available, multiple size of wafers are polishable in one system.
Mounting of wafer loader enables full-automatic operation
Mounting of cleaning unit enables precise cleaning
Air-float Head "Sylphide"
Air film formation provides very uniform pressure distribution in the wafer plane
Possession of an airbag independent of an air film provides low-pressure stability
An independent retainer pressure airbag provides excellent edge profile control
One-touch replacement of retainer/membrane reduces downtime (see below)
Addition of zone control function is available (optional)
Optical End-Point Detection System
Uses white light source and accurately detects residual film changes with reflection data of wide wavelength range and special algorithm.
Sylphide
Provides a wide range of applications
Various optional functions for mass production are available
Related Products
