Semiconductor Manufacturing Equipment
Resin Bond Blade : PG Series
Dicing
Cutting
Blade
QFN
Burr
The PG Series supports not only standard QFN but also next-generation QFN such as wettable QFN.

Resin Bond Blade : PG Series

Features

Resin blade series for lead frame packages such as QFN and DFN

A variation is expanded in pursuit of the high-speed cutting, long lifespan, and stable cutting quality

Available with the latest Wettable type and DR-QFN

Processing Target

Lead frame packages

Glass

Ceramics

Processing Example

QFN cutting example
n = 20,000 min-1
f = 70 mm/sec

High-quality cutting can be achieved by minimizing burrs under high-speed conditions.

Processing Example
Processing Example