Semiconductor Manufacturing Equipment
Resin Bond Blade : GC Series
Dicing
Cutting
Blade
Glass
Ceramics
The GC Series has a blade for cutting high quality glass and ceramics by making use of the characteristics of soft resin.

Resin Bond Blade : GC Series

Features

Resin blade series for glass, ceramics and other hard brittle materials

A variation is expanded in pursuit of the high-speed cutting, long lifespan, and stable cutting quality

Processing Example

セラミック 切断事例

Ceramic cutting example
n = 25,000 1/min-1
f = 8 mm/sec

High-accuracy cutting is now possible in any unstable situation. 

ガラス 切断事例

Glass cutting example
n = 25,000 1/min-1
f = 10 mm/sec

High-quality cutting is offered through the service life due to its sharp edge and excellent maintainability of shape.