Semiconductor Manufacturing Equipment
Nickel Bond Blade : DS Type
Dicing
Cutting
Blade
Substrate
Electronic Components
The nickel hubless blade has a proven record of responding to a range of demands, such as for various wafer types and composite substrates.

Nickel Bond Blade : DS Type

Features

High accuracy and high-speed cutting

Excellence in blade rigidity and abrasion resistance

Sharp cutting ability, effective on burrs occurring

3 concentration levels are available

Expansion of the application by adding variations to the slit shape

Specifications

Specification and notation

Specification and notation

Concentration level

Concentration level

Slit

Slit

Lapping process

Lapping process

Lapping Process is possible with blade thickness more than 0.06T & blade O.D. lesser than 60D.

Dimension and notation/dimension standard

Dimension and notationDimension and notation

Dimension and notationDimension and notation

Dimension standard

Dimension standard

*1

For #325, the tolerance is ±0.01

*2

For a blade thickness of 0.025 to 0.05, the tolerance is ±0.003

Drawing Notation

Drawing Notation

Type whose producibility depends on the mesh size

Type whose producibility depends on the mesh size

*3

4/6S, 4/8S are supported with 0.04 to l0.1T or lower (lap product of 0.08 to 0.15T or lower) and an outer diameter of less than 59 D (lap product of less than 0.1 T is 56 D or less). 

*4

30/40S, 40/60S are supported with T in the range 0.2≦T≦0.25.

Blade thickness whose producibility depends on the mesh size

Blade thickness whose producibility depends on the mesh size

Processing Target

Raw ceramics

Chip LED

Various types of substrates

Hard, brittle materials

Processing Target

ACCRETECH A-WD-100A
UV-TAPE (PO TYPE)
18,000 min-1
50 mm/sec

Processing Target

ACCRETECH A-WD-100A
UV- TAPE (PET TYPE)
30,000 min-1
150mm/sec