Semiconductor Manufacturing Equipment
Metal Bond Blade : HM Series
Dicing
Cutting
Blade
BGA
Electronic Components
The HM Series supports cutting of various types of electronic components, such as BGA and QFN, with its extensive bond variation.

Metal Bond Blade : HM Series

Features

High sintering technologies bring out the properties to correspond to the various applications

Unique manufacturing processes provide uniform distribution of grit, and performance stability

Improved the high cutting ability and wear resistance using the special grit

Accumulated plenty of successful cases of QFN cuttings

Processing Target

Various types of glass

Various types of electronic substrates

Ceramics

Processing Example - Metal Blade (HM Series)

QFN package cutting

Resin blade is generally used in QFN cutting field, however it can be cut by metal blade as well. Metal blade is expected to be a long life blade to cut QFN.

Cutting with HM046

QFN package cutting
QFN package cutting

Cutting with HM046

It has a large share of this cutting field. It has a good reputation for cutting quality and performance stability. 

It has a large share of this cutting field. It has a good reputation for cutting quality and performance stability.

AI2O3 substrate

AI2O3 substrate

SiN substrate

SiN substrate