Sliced Wafer Demounting and Cleaning Machine: C-RW Series

Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw


  • Automatic demounting of wafers from the slicing base, cleaning and storing into the cassette
  • Compatible with variety of materials
  • Realize a low running cost

About Semiconductor Manufacturing Equipment

Contact Us / Request for Brochures