| 40' |
1949 |
Tokyo Seimitsu Kogu Co., Ltd. is established Appoints Kozo TOJIMA as chairman |
 |
| 50' |
1950 |
Appoints Gonzo ISAHAYA as chairman |
| 1951 |
Commences manufacture and sale of measuring machines using mechanical gauges |
| 1953 |
Develops Japan's first flow type air micrometer |
 |
| 1955 |
Appoints Makoto TAKAGI as chairman |
| 1957 |
- Develops Japan's first LVDT type electric micrometer Establishes
- Daiichi Seiki Co., Ltd.
|
| 1958 |
Develops Japan's first germanium pellet auto-sorter |
 |
| 60' |
1962 |
- Renames the Company as Tokyo Seimitsu Co., Ltd.
- Stock is listed on the Tokyo Stock Exchange 2nd Section
- Develops surface texture measuring instrument
|
| 1963 |
- Develops Japan's first wafer slicing machine Opens Hachioji Plant
|
| 1964 |
Develops first wafer probing machine in Japan Commences sales of turn-key plant and production technology for electric and air micrometers to China |
 |
| 1967 |
Develops cylindrical form measuring instruments |
| 1969 |
- Establishes Tosei Engineering Service Co., Ltd. (currently Tosei Engineering Corp.)
- Opens Tsuchiura Plant
- Develops Japan's first coordinate measuring machine
|
|
| 70' |
1970 |
Develops wafer dicing machine |
| 80' |
1980 |
Appoints Akira MIURA as chairman |
| 1985 |
Establishes Tosei Systems Co., Ltd. jointly with CEC as a software development group |
| 1986 |
- Stock is listed on the Tokyo Stock Exchange 1st Section
- Appoints Goro IMAZAWA as chairman
|
| 1987 |
Establishes Research Laboratory |
| 1988 |
Appoints Shozaburo KARUBE as chairman |
| 1989 |
Establishes TOKYO SEIMITSU EUROPE GmbH (GERMANY) and TOKYO SEIMITSU AMERICA, INC. (USA) |
| 90' |
1992 |
- Appoints Hideo OHTSUBO as chairman
- Acquires Silicon Technology Corporation (STC) of the United States
- Establishes TSK Service Center in Korea
- Renames Daiichi Seiki Co., Ltd. as Micro Technologies Co., Ltd.
|
|
| 1994 |
- ISO 9001 certification is awarded to the Hachioji and Tsuchiura Plants
- Hachioji Plant attains business license under the traceability system of the Measurement Law for the calibration of the "length measurement laser"
- Establishes Beijing Representative Office is established
- Establishes TOKYO SEIMITSU (MALAYSIA) SDN. BHD.
|
 |
| 1995 |
- Tsuchiura Plant attains business license under the traceability system of the Measurement Law for the calibration of the "block gauge"
- Sets up Sanmenxia Zhongyuan Tokyo Seimitsu Co., Ltd. as a joint venture enterprise with Zhongyuan Measuring Instrument Co., Ltd. of China
- Establishes TSK AMERICA, INC. and TSK MANUFACTURING COMPANY in the United States
- Enters into partnership with Carl Zeiss in the field of high precision measuring instruments
- Concludes licensing agreement with Kulicke and Soffa Industries, Inc. of the United States for the sale of dicing machines
|
 |
| 1996 |
- Receives "10 BEST Award" for "Customer satisfaction with a semiconductor equipment supplier" (Survey by VLSI Research Inc.)
- Establishes TSK Technical Center in Hsinchu, Taiwan
- Establishes TOKYO SEIMITSU (ISRAEL) LTD.
|
 |
| 1997 |
- Opens New Nagoya Plant of Tosei Engineering
- Receives "10 BEST Award" for 2nd consecutive year
- Establishes TOKYO SEIMITSU (SINGAPORE) PTE. LTD.
- Integrates U.S. subsidiaries into TSK AMERICA, INC.
|
| 1998 |
- Hachioji and Tsuchiura plants obtain ISO 14001 certification
- Receives "10 BEST Award" for 3rd consecutive year
|
 |
| 1999 |
- Inaugurates new head office of Tosei Engineering in Tsuchiura
- Reorganizes MICRO TECHNOLOGIES CO., LTD. into TSK MICRO TECHNOLOGIES CO., LTD. to support the development, manufacture and sale of wafer inspection systems
- Establishes TSK FINANCE CO., LTD.
- Receives "10 BEST Award" for 4th consecutive year
- Initiates business partnership for wire saws and related devices with HCT of Switzerland
- Unveils New symbol mark at SEMICON Japan
|
|
00'
|
2000 |
- Signs sole Japanese dealership contract for 3D vision systems with CogniTens of Israel
- Receives "10 BEST Award" for 5th consecutive year
- Establishes LEEPL Corp. with U.S. company Nanolith, L.L.C. and ANGEL Labs Corp.
- Develops wafer inspection system
- Develops world's first polish grinder
|
|
| 2001 |
- Introduces corporate brand "ACCRETECH"
- Opens new Hachioji Main Plant Building
- Receives "10 BEST Award" for 6th consecutive year
- Establishes LEEPL Technology Consortium
- Establishes TSK Box Corp.
- Establishes TSK MICRO TECHNOLOGIES KOREA CO., LTD.
- Tosei Engineering Corporation stock is listed on the Tokyo Stock Exchange 2nd Section
|
|
| 2002 |
- Introduces Executive Officer System and In-House Company System at Semiconductor Company, Metrology Company and Administration Company
- Establishes ACCRETECH (CHINA) CO., LTD., an affiliated company in China
- Renames TSK MICRO TECHNOLOGIES CO., LTD. as ACCRETECH MICRO TECHNOLOGIES CO., LTD.
- Renames TSK FINANCE CO., LTD. as ACCRETECH FINANCE CO., LTD.
- Renames TSK AMERICA, INC. as ACCRETECH USA, INC.
- Renames TOKYO SEIMITSU (MALAYSIA) SDN. BHD. as ACCRETECH (MALAYSIA) SDN. BHD.
- Renames TOKYO SEIMITSU (ISRAEL) LTD. as ACCRETECH (ISRAEL) LTD.
- Renames TOKYO SEIMITSU (SINGAPORE) PTE. LTD. as ACCRETECH (SINGAPORE) PTE. LTD.
- Renames TSK MICRO TECHNOLOGIES KOREA CO., LTD. as ACCRETECH MICRO TECHNOLOGIES KOREA CO., LTD.
- Receives "10 Best Award" in two categories: Test & Material Handling Equipment category (7th consecutive year) and Assembly Equipment category (first time)
- Develops next-generation wafer inspection systems in conjunction with Hitachi High Technologies Corp.
- Jointly develops new laser dicing equipment, MAHOHDICING MACHINE, for semiconductor manufacturing equipment market, together with Hamamatsu Photonics K.K.
- Develops Chemical Mechanical Planarizer (CMP)
|
 |
| 2003 |
- Separates Roles of Chairman & C.E.O. and President & C.O.O.
- Appoints Hideo OHTSUBO as Chairman & C.E.O.
- Appoints Sadakatsu SUZUKI as President & C.O.O.
- Receives "10 BEST Award" in two categories: Test & Material Handing Equipment category (8th consecutive year), Assembly Equipment category (2nd consecutive year; ranked No.1)
- Develops E-beam lithography system
|
 |
| 2004 |
- Receives "10 BEST Award" in two categories: Test & Material
- Handing Equipment category (9th consecutive year), Assembly
- Equipment category (3rd consecutive year; ranked No.1)
|
|
| 2005 |
- New Semiconductor Plant Hachioji Completed
- New Measuring Instrument Plant in Tsuchiura Completed
- Receives "10 BEST Award" in two categories: Test & Material Handing Equipment category (10th consecutive year), Assembly Equipment category (4th consecutive year; ranked No.1)
- Sadakatsu SUZUKI, President & C O O, named President C E O & C O O
- Hideo OHTUBO, former Chairman and present Principal Adviser, became the first foreigner to be bestowed the title of Honorary Adviser of the CSIA(China Semiconductor Industry Association)
- Renewed partnership agreement with Carl Zeiss for another 5 years
|
|
| 2006 |
- Receives "10 BEST Award" in two categories
- Test & Material Handing Equipment category (11th consecutive year),
- Assembly Equipment category (5th consecutive year; ranked No.1)
- Released "UF3000EX" that supports the last generation of 300mm Wafer prober.
|
 |
| 2007 |
- Establishment of Accretech Korea Co., Ltd.
- MAHOH DICING MACHINE was granted the Chairman' Award of The Japan Machinery Federation at its 27th JMF Award for Energy-Conserving Machinery.
- Received the "10 BEST Awards" in two categories:
awarded for 12 consecutive years in the Test & Material Handing Equipment category, and for 6 consecutive years in the Assembly Equipment category
- Obtained a business license at Tsuchiura Plant under the traceability system of the Measurement Law for the calibration of the "length measurement laser" and "3D Coordinate Measuring Machine"
- Separation of roles of C E O & C O O
- Kazuo FUJIMORI named C O O
- Establishment of ACCRETECH Taiwan Co., Ltd
|
|
| 2008 |
- Recieved the "10 BEST Awards" in two categories:
- awarded for 13 consecutive years in the Test & Material Handing Equipment category, and for 7 consecutive years in the Assembly Equipment category
- Technical cooperation with Mitaka Kohki Co., Ltd in non-contact metrology
|
|
| 2009 |
- Establishment of Tokyo Seimitsu USA Branch
- Appointment of Mr. Kazuo FUJIMORI as CEO.
|
|
| 10' |
2010 |
- Establishment of Tokyo Seimitsu USA Branch
|
|
| 2011 |
- Appointment of Mr. Kunimasa OTA as CEO.
- Started mass-production of "AD3000T/S" of the world's smallest and fastest dicing machine in the most advanced semiconductor line.
- Establishment of the local corporation, Tokyo Seimitsu （Thailand） Co., Ltd..
|
 |
| 2012 |
- Establishment of "ACCRETECH Application Center" corresponding to the diversification of the device process.
- Began manufacturing, development and sales upon "the acquisition of precision blade business" from Mitsubishi Materials.
- Opened the representative office Tokyo Seimitsu Co., Ltd. Indonesia.
|
|
| 2013 |
- Establishment of the local corporation, ACCRETECH Vietnam Co.,.
- Released non-contact sensor "Opt-measure."
|
 |
| 2015 |
- Appointment of Mr. Hitoshi YOSHIDA as CEO.
- Released Non-contacted/three-dimensional surface roughness and contour measuring instrument "Opt-scope."
- Establishment of PT. ACCRETECH Indonesia
- Establishment of ACCRETECH ADAMAS （Thailand）Co., Ltd.
|
 |
| 2016 |
- Construction of new plant (No.6 Plant） in Hachioji was completed
- Obtained JIS Q 9100 Certification
|
|
| 2017 |
- Cooperated with Panasonic Factory Solutions Co., Ltd. in the development of laser grooving devices
- Published the ACCRETECH Declaration on Women's Advancement
- Released high accuracy CNC coordinate measuring machine XYZAX AXCEL
- Released SURFCOM TOUCH series of intuitive operation type surface texture measuring instruments
|
|
| 2018 |
- Released RONDCOM CREST, ultra-high precision roundness and cylindrical profile measuring instrument
- Released AltaProv, multi-stage prober for wafer collective measurement
|
|
| 2019 |
- Purchased a majority shareholding in Fujitsu Telecom Networks Fukushima Limited (now Accretech Powertro System Co., Ltd.) which provides Charge/Discharge testing systems and became a subsidiary.
- Tosei Engineering Corp. and its subsidiary Tosei America Inc. acquired the balancer business from the US manufacturer Schmitt Industries Inc.
|
|
| 20' |
2020 |
- Renovation for expanding sales and service/support capability of Osaka branch was completed
- Construction of new plant (MI Building) in Tsuchiura was completed
|
|
| 2021 |
- Construction of new building for Tokyo Seimitsu subsidiary Accretech Taiwan Co., Ltd was completed
- New Taiwan Application Center was opened
|
 |
| 2022 |
- Appointment of Mr. Hitoshi Yoshida as Chairman and CEO.
- Appointment of Mr. Ryuichi Kimura as President and COO.
- Due to the revision of the market classification of the Tokyo Stock Exchange, the Company moved to the Prime Segment
|
|
