sitemap
Company information
Company Profile
Message from the Management
Tokyo Seimitsu’s Aspiration
ACCRETECH Group Code of Conduct
Anti-Bribery and Anti-Corruption Policy
Management Policy
Internal Control System Policy
Human Rights Policy
Information Security Policy
Internal Control System Policy
ACCRETECH Group
History
Document Library
Sustainability
Solution / Products
Semiconductor Manufacturing Equipment
Dicing Machines
Probing Machines
Polish Grinders
High Rigid Grinder
CMP
Edge Shaping Products
Sliced Wafer Demounting and Cleaning Machine
Consumables
Precision ACCRETECH Dicing Tools
Auxiliary Equipment
Dicing Machines
Probing Machines
Systems
Coordinate Measuring Machines
X-ray CT system
Surface Texture and Contour Measuring Instruments/Systems
Non-contact Surface Texture and Contour Measuring Instruments/Systems
Optical shaft measuring system
Dedicated measuring machine
discharge test system
battery jig
Power Supply Evaluation Services
Roundness and Cylindrical Profile Measuring Instruments
Sensor
Laser Interferometers
Non-contact Displacement Sensors
Grinder and Lathe
Air Micrometers
Machining Center
Software
for Coordinate Measuring Machines
for Surface Texture and Contour Measuring Instruments/Roundness and Roundness and Cylindrical Profile Measuring Instruments
for Optical Shaft Measuring Systems
for Laser Interferometers
for Data Collection and Management
for X-ray CT Systems
Accessory
for Coordinate Measuring Machines
for Surface Texture and Contour Measuring Instruments/Roundness and Roundness and Cylindrical Profile Measuring Instruments
for Grinder and lathe
for Air Micrometers
Optical shaft measuring system
NEWS
Event
Contact・Request Information