Wafer Dicing Machines:A-WD-300TX
Feature
Spindle rotation speed of 80,000 min-1 made possible
The spindle axis comes standard equipped with a newly developed 80,000 min-1 high speed spindle,a result of Tokyo Seimitsu's accumulated expertise in processing technology.
Tokyo Seimitsu is opening up a new domain in processing, with previously unattainable high-speed dicing and high processing quality.
(Patent pending)
X-axis travel speed of 1,000 mm per second attained. Industry first!
Through pursuing ever increasing speed for X-axis linear motors,we have achieved a travel speed of 1,000 mm /s, an industry first.
Increased high speed throughput has been achieved In the drive section, Tokyo Seimitsu uses a well-established air guide system that in combination with the linear motor forms a completely non-contact mechanism offering high processing quality with reduced vibration.
Cleaning time reduced by half with the triple air accelerated cleaning head. Industry first!
By reducing cleaning time to half that of conventional systems, transfer section waiting time has been greatly decreased.
The excellent cleaning results produced by the triple air accelerated cleaning head are particularly effective in eliminating contaminant deposits after slicing.
(Patent pending)
Contamination reduced with the water cleaning unit. Industry first!
Contaminant deposits created during dicing have been reduced with the water cleaning unit, equipped as standard.
(Patent pending)
Wafer does not drop even if air is cut-off .Industry first!
With the wafer protection system equipped in the transfer arm,even if air is cut-off, the wafer is prevented from dropping.
An adjustable speed stepping motor is used in the wafer contact section. Through use of this system stress placed on thin wafers and small chip wafers vulnerable to impact when detaching has been reduced, making highly reliable and stable transferring possible. (Patent pending)
RED-LED lighting, new model microscope adopted
Through use of RED-LED lighting and a new model microscope, wafer contrast and resolution as seen on the monitor have been significantly improved.
17-inch touch screen panel monitor employed
The monitor used has progressed forward to a touch panel system enabling intuitive operation.
Visibility and operability have been improved with a larger operation display.
Automation of software
We offer GUI (Graphic User Interface) based operations, emphasizing automation and simplification.
The complicated procedures and settings required by operators in conventional models have been done away with as much as possible, and the device itself makes judgments and actively assists with operations.
Improved error recovery functions and reduction in operation times have been made possible.
One microscope and optical cutter set unit per spindle
One high magnification microscope and optical cutter set unit is provided for each of the Z1 and Z2 spindles, shortening the time required for alignment, kerf checking and setting up, as well as increasing speed.
To prevent contaminant deposits, a mechanical cover has been provided for the microscope and optical cutter set unit.
Standard adoption of a pitch between blades of 25 mm
For small chip devices, high productivity can be maintained by reducing the pitch between blades.
By reducing the pitch between blades from the conventional figure of 34 mm to 25 mm, superior productivity is demonstrated with standard specifications.
Superior maintainability
An optimal device layout simplifies front and rear access, significantly improving maintainability.
USB interface adopted
A USB interface has been adopted enabling effective upgrading and storage of device data.
Specifications
A-WD-300TX Specifications
| Wafer size | Max. ø 310 mm | |
|---|---|---|
| Usable frame size | 8", 12" | |
| Spindle 1, 2 | Rated output | 1,200kW |
| Maximum speed | 80,000min-1 | |
| Static dicing accuracy | 0.004mm | |
| X axis | Feed rate range | 0.1 ~ 1,000mm/s |
| Y 1, 2 axis | Accuracy | 0.002mm/310mm |
| Control resolution | 0.0001mm | |
| Slicing range | 310mm | |
| Z 1, 2 axis | Accuracy | 0.003mm/1mm |
| Stroke resolution | 0.0002mm | |
| Repeatability precision | 0.0015mm | |
| Blade diameter | φ60mm | |
| θ axis | Control resolution | 0.3arc-s |
| Rotation angle | 720deg | |
| Power supply | AC 200 - 220 V, 3 phase, 50/60 Hz *Multiple power supply types supported with optional transformer |
|
| Air supply | Source pressure | 0.5 - 0.7 Mpa |
| Consumption | Average 250ℓ/min *Excludes air blow | |
| Nitrogen | Source pressure | 0.5 - 0.7 Mpa |
| Consumption | Average 100ℓ/min | |
| DI water for cutting | Source pressure | 0.4 - 0.5 Mpa |
| Consumption | Max. 12ℓ/min | |
| DI water for cleaning | Source pressure | 0.4 - 0.5 Mpa |
| Consumption | Max. 4ℓ/min | |
| Spindle coolant | Source pressure | 0.2 - 0.5 Mpa |
| Consumption | 3ℓ/min (Municipal water possible) | |
| Dimensions | 1,650W×1,420D×1,800Hmm *Excludes protruding parts |
|
| Weight | 1,800kg | |
Main Options
- Built-in UV curing unit
- Booster pump unit
- Forced exhaust fan
- Thermo regulator for Water
- Static eliminator
- Z-axis scale
- Adjustable light source color for microscope lighting
- 3-inch blade compliance
- Air accelerated cleaning unit for slicing section
- Melody alarm
- Barcode-based automatic device switching
- Utility cassette
- Frame vacuum clamp
- Production management system
- GEM networks communication
- Operation management system
- Multiple power supply compatible
- transformer
- Resistivity, temperature monitor
Wafer Probing Machines: UF3000EX
Next-generation high-spec probing machine the world No.1 supplier presents
Phenomenal levels of throughput have been made possible with the synergistic effects of high-speed wafer handling enabled by a new algorithm, and the high-speed and low-noise XY Stage enabled by a newly developed purpose-built drive unit for probes. The Z axis ensures world-class load capacity and high precision, and offers excellent contact via an optimal structural design that employs topology which reliably eliminates changes in flatness due to positioning.
With advanced OTS latest positioning system technology and by colorizing wafer alignment imaging and equipping a light super magnification function, the UF3000EX has improved dramatically in terms of precision and operability.
Wafer Dicing Machines:A-WD-200T
Feature
High Throughput
An opposing, twin spindle arrangement and accelerated motion on the X-axis (up to 600mm/sec) achieve greater throughput.
The mechanism uses linear motor, ceramic guides and air bearings.
High Reliability
By using a linear motor on the X-axis, in addition to air bearings and ceramic guides, we have produced a completely contact-free drive mechanism, which is maintenance free. The suction-type frame handling system uses our unique and renowned methods to process wafers cleanly and rapidly, with remarkable reliability. Moreover, the new high-speed high-rigidity spindles achieve excellent reliability and low vibration.
Our unique frame handling system
Keeps the wafer clean
The suction-type frame handling is clean, reliable, and speedy processing with the least waiting time. As wafers are picked up by a different suction mechanism before and after cleaning, wafers are kept clean after the cleaning process.
Blade breakage detector
A highly sensitive optical method detects blade breakage in real time.
Space Saving
Besides achieving high throughput, high processing quality and easy operation, this twin-spindle machine which handles 8" wafers has the smallest footprint.
High Proccessing Quality
The use of a linear motor for the X-axis reduces vibration, and the support mechanism for spindle has high rigidity. These advances enable higher cutting quality.
Inspection stage for monitoring cutting quality
The designated wafer is automatically extracted to the inspection stage for inspection which is indispensable for dicing process. After inspection, the wafer is automatically returned to the original slot from the inspection stage.
Easy Operation
A high-resolution LCD screen and touch panel produce an operation screen that is easy to understand and use.
Specifications
A-WD-200T Specifications
| Cutting wafer size | 1"- 8" | |
|---|---|---|
| Usable frame sizes | 6", 8" | |
| X-axis | Stroke | 450 mm |
| Cutting stroke | 250 mm | |
| Cutting speed | 0.1 mm - 600 mm / sec | |
| Y-axis | Stroke | 250 mm |
| Maximum speed | 100 mm / sec | |
| Positioning accuracy | 0.002 mm / 250 mm | |
| Z1 / Z2 axis | Stroke | 34 mm |
| Maximum speed | 40 mm / sec | |
| Positioning accuracy | 0.003 mm / 1.0mm | |
| θ axis | Rotation range | 380° |
| Resolution | 3.1958×10-2 rad | |
| Spindle | Type | Air spindles with built in DC brushless motors |
| Maximum rotation speed | 60,000rpm | |
| Rated output | 1.2kW | |
| Spinner | Maximum rotation speed | 3,000rpm |
| Misc. specifications | Power supply | Three phase AC 200 / 220 / 240 / 380 / 415 V ±10% |
| Maximum power consumption | 4.0kVA | |
| Air supply | 0.5 - 0.7 Mpa 300L / min (ANR) | |
| Nitrogen gas supply | 0.5 - 0.7 Mpa 100L / min (ANR) | |
| Coolant water | 0.4 - 0.5 Mpa 12L / min max | |
| Low-pressure cleaning water | 0.2 - 0.5 Mpa 5L / min max | |
| Device dimensions | 1,230 (W) × 1,240 (D) - 732 (W) × 306 (D), 1,350 (H) mm | |
Options
Blade breakage detection
The state of the blade is constantly monitored during processing, protecting the wafer from damage by a broken blade.
Optical cutter set unit
The cutting position is set without any physical contact, avoiding damage to the blade.
Shape recognition device
This device automatically recognizes the shape of broken and partial wafers and optimizes the processing range to enable highly efficient processing.
Cassette for automatic dressing
A frame mounted with up to five dress boards or mirror wafers can be mounted to allow automatic dressing, even while the machine is in motion.
Built-in UV curing unit
Low cost, high performance UV curing unit can be loaded.
Bar code recognition for automatic device data changeover
Bar codes marked on cassettes or frames can be read to change device data automatically.
Melody alarm
The alarm can be set to play a specified melody.
System compatible with FA
GEM networks systems is available.
High-pressure pump unit
This unit produces high pressured water for spinner cleaning.
Booster pump unit
This unit boosts the pressure of water for cutting.
Thermo regulator for water
This equipment controls temperature of feed water (D. I. Water).
Wafer Dicing Machines:A-WD-250S
Feature
Largi-sized substrates
With a Y-axis stroke of 256 mm, large-sized substrates (long side:230 mm) can be processed. Additionally, frames mounted with two substrates can also be automatically processed.
High Reliability
Blade breakage detector
A highly sensitive optical method detects blade breakage in real time.
High Processing Quality
A high-resolution LCD screen and touch panel produce an operation screen that is easy to understand and use.
Inspection stage for monitoring cutting quality
The designated wafer is automatically extracted to the inspection stage for inspection which is indispensable for dicing process. After inspection,the wafer is automatically returned to the original slot from the inspection stage.
Our unique frame handling system
Keeps the wafer clean
The suction-type frame handling is clean, reliable, and speedy processing with the least waiting time. As wafers are picked up by a different suction mechanism before and after cleaning, wafers are kept clean after the cleaning process.
Space Saving
Besides achieving high throughput,high processing quality and easy operation, this model has the smallest footprint of any machine for CSP substrates in the world.
Specifications
A-WD-250S Specifications
| Cutting wafer size | 1" - 8", 230 × 145 mm (CSP substrates) | |
|---|---|---|
| Usable frame sizes | 5", 6", 8" | |
| X axis | Movement stroke | 400 mm |
| Cutting speed | 0.1 - 600 mm/s | |
| Y axis | Movement stroke | 256 mm |
| Maximum speed | 80 mm/s | |
| Z axis | Movement stroke | 35 mm |
| Resolution | 0.0002 mm | |
| θ axis | Rotation range | 290° |
| Minimum angular setting range | 0.648" | |
| Alignment | Microscope | High/ Low magnification are interchangeable |
| Magnifications on the monitor | High : 350 × Low : 88 × | |
| Spindle | Type | DC brushless motor internal air spindle |
| Maximum revs. | 60,000 min-1 | |
| Spinner | Maximum revs. | 3,000 min-1 |
| Others | Power supply | 200/220/240/380/ 415 V AC ±10%, 3 phase |
| Power consumption | 2.5 kVA | |
| Air supply | 0.5 - 0.6 MPa, 220ℓ/min | |
| Spindle coolant water | 0.2 - 0.5 MPa, 1.5ℓ/min | |
| Cutting water | 0.4 - 0.5 MPa, 2 - 8ℓ/min | |
| Nitrogen gas supply | 0.5 - 0.6 MPa, 100ℓ/min | |
| Equipment dimensions / weight | 1153 W × 1,170 D × 1,300 H mm / 1,000 kg | |
Options
Optical cutter set unit
The cutting position is set without any physical contact, avoiding damage to the blade.
Shape recognition device
This device automatically recognizes the shape of broken and partial wafers and optimizes the processing range to enable highly efficient processing.
Cassette for automatic dressing
A frame mounted with up to five dress boards or mirror wafers can be mounted to allow automatic dressing, even while the machine is in motion.
Built-in UV curing unit
Low cost, high performance UV curing unit can be loaded.
Bar code recognition for automatic device data changeover
Bar codes marked on cassettes or frames can be read to change device data automatically.
Melody alarm
The alarm can be set to play a specified melody.
System compatible with FA
GEM networks systems is available.
High-pressure pump unit
This unit produces high pressured water for spinner cleaning.
Booster pump unit
This unit boosts the pressure of water for cutting.
Thermo regulator for water
This equipment controls temperature of feed water (D. I. Water).
Wafer Dicing Machines: AD20T
Feature
Foot print
The world’s smallest footprint. Footprint reduced 40% compared with Accretech’s existing machines.
High Throughput
Twin-spindle design. Substantially higher through-put resulting in lower CoO.
High Accuracy
Cutting quality is improved with the new design due to high rigidity and low vibration.
Wafer Dicing Machines:A-WD-10B
Feature
- The Z-axis drive unit encoder system stepping motor guarantees high accuracy and reliability, and the X- and Y- axis slide section has a high accuracy, high rigidity linear guide.
- Simultaneous 2-axis control of X- and Y-axis and high throughput, with a max. speed of X-axis: 450mm/s, Y-axis: 80mm/s and Z- axis: 40 mm/s.
- A conveniently-located compact operating panel, rubber switch and jog dial optimized to the operation type (one hand operation) are used; an LCD panel is also used.
Common usages
- Electronic parts (SMD, HIC, Piezo device, etc)
- Semiconductors (Si, GaAs, etc)
- Glass (crystal, filter, small LCD, etc)
- Thermal Head (Small), New Materials
The clarity of the microscope image and the accuracy of image recognition are improved by LED lighting.
(Ring lighting specification: Optional)
User-friendly Operating Panel
Operation Display
Function Management System
Registering frequently used functions and creating shortcuts improves operability.
Specifications
A-WD-10B Specifications
| Work Size | 162 × 162 mm | |
|---|---|---|
| X axis | Movement stroke | 290 mm |
| Cutting speed | 0.1 - 450 mm/s | |
| Y axis | Movement stroke | 162 mm |
| Maximum speed | 80 mm/s | |
| Positioning accuracy | 5 µm | |
| Z axis | Movement stroke | 35 mm |
| speed | 40 mm/s | |
| Resolution | 0.0001 mm | |
| θ axis | Rotation range | 290° |
| Positioning resolution | 0.00018°(0.648") | |
| Alignment | Microscope type | Split-field type |
| Camera, LCD | Standard (12.1" magnification 211 ×) | |
| Spindle | Type | Air spindle with a built-in high-frequency AC motor |
| Maximum revs. | 40,000 min-1 | |
| Maximum output | 900W | |
| Others | Power supply | 200/220V AC , 3 phase |
| Power consumption | 2kVA | |
| Air supply | Air supply 0.55 - 0.6 MPa, 180ℓ/min | |
| Spindle coolant water | 0.2 - 0.5 MPa, 1.5ℓ/min | |
| Cutting water | 0.2 - 0.5 MPa, 5ℓ/min max | |
| Equipment dimensions, weight | 650 W × 890 D × 1,300 H mm, 500 kg | |
Main Options
A-CS-100A (Optional)
- Non-contact optical cutter setting unit
- Blade breakage detector
- 3” flange compatibility
- Y-scale positioning accuracy:2 µm/162 mm
- Cover interlock
- Ring lighting
- Middle power spindle
- 3 color indication lamp
- Mist fan
- CE marking
- A-CS-100A (Spin Cleaner/Dryer)
Wafer Dicing Machines:PS280
Feature
Twin Cutting-stage Mechanisms and Independent Microscope Drive Mechanism
The new parallel spindle drive shaft with an independent microscope drive shaft – make simultaneous cutting and alignment operations possible. This combines with PS280’s twin cutting stage mechanisms to bring unparalleled performance!
Large Cutting Area
PS280’s large cutting area ensures smooth scrap processing and easy maintenance (Patent pending).
Wide, Bright Image Processing
The optical system comes with a wider visual field and higher, brighter resolution – greatly assisting image processing during operations such as alignment. The results – reduced alignment error and shorter alignment time (Patent pending).
Specifications
| Items | PS280 |
|---|---|
| Applicable work size (Max) | 280 x 110 mm 215mm |
| Saw-jig size (Max) | φ312 mm |
| Spindle type | Mechanical bearing type |
| Spindle output power | 1.8 kW |
| Rotation speed (Max) | 30 min-1 |
| Blade size | 3 inches |
| X-axis cutting speed | 0.1～600 mm/sec (X1, X2, both axes) |
| Y1, Y2, and Microscope-axis stroke | 300mm (Y1, Y2, both axes) |
| Y1, Y2, and Microscope-axis positioning accuracy | 0.005/300 mm |
| Z1, Z2, and Focus-axis positioning accuracy | 0.003/1 mm |
| Theta-axis rotation range | 195° |
| Power supply | AC200~220V 3phase 50/60Hz |
| Air supply | 0.55~0.7 MPa 390 L/min |
| D.I.water supply | 0.4~0.5 MPa 12 L/min |
| Spindle cooling water | 0.2~0.5 MPa 3 L/min |
| Machine size (W x D x H mm) | 1600 x 1685 x 1760 mm |
Automatic Cleaning System:A-CS-100A
Feature
- Maximum rotation speed of spinning table is up to 3,000 min-1
- Available frame size: 5 to 8”
- Cleaning method: High-pressure,Rinse, Air dry (Driven by swing arm)
Specifications
A-CS-100A Specifications
| Frame size capability | 5 to 8” |
|---|---|
| Spinning table speed | 30 to 3000min-1 |
| High-pressure cleaning | 30 to 10 MPa |
| Rinse water pressure | Less than 0.4 MPa |
| Drying air pressure | Less than 0.7 MPa |
| Facilities | |
| Power supply | AC 100V 50-60Hz (Single phase) |
| Power consumption | 500 VA (Max.) |
| Air supply | 0.5 to 0.7 MPa 200 NL / min |
| Water supply | 0.2 to 0.7 MPa 2L / min |
| Over-all dimension | 400Wx650Dx1076F |
| Over-all weight | 125 kg |
Wafer Dicing Machines:ML300
Feature
In this system, a modification layer is formed inside the Si wafer through optical damage called multiphoton absorption, and chips are segmented at this point. In ML300, the back surface of the wafers is exposed to Laser light whilst the surface protection tape used for the back-grinding process is left attached.
Specifications
ML300 MAHOHDICING MACHINE Specifications
| Applicable wafer size | Circular wafer : 8, 12 inches diameter | |
|---|---|---|
| X-axis | Stroke | 560 mm |
| Cutting feed rate | 0.1 mm to 600 mm/sec | |
| Positioning resolution | 0.002 mm | |
| Straightness | 0.0015 mm / 350 mm | |
| Y-axis | Stroke | 427 mm |
| Driving speed | 100 mm/sec max | |
| Positioning resolution | 0.0002 mm (closed-loop control) | |
| Positioning accuracy | 0.002 mm / 320 mm | |
| Z-axis | Stroke | 9 mm |
| Driving speed | 20 mm/sec max | |
| Positioning resolution | 0.0001 mm (closed-loop control) | |
| Positioning accuracy | 0.001 mm / 1 mm | |
| Power supply | Supply voltage : Selected from 200/220/240/380/415 V AC ± 10% 3 phase, 50 to 60 Hz. | |
| Power consumption | 4.0 kVA max | |
| Compressed air | Pressure : 0.5 to 0.7 MPa | |
| N2 gas | Pressure : 0.5 to 0.7 MPa | |
| Thermal regulator for water for laser cooling | Pressure : 0.2 to 0.5 MPa | |
| Dimensions | 1,630W × 1,641D × 1,986H mm | |
| Weight | 1,900 kg | |
ML300RME Equipment Configuration
“Stealth Dicing” is new laser dicing technology developed by Hamamatsu Photonics.
Options
By connecting a UV irradiator with RME300 in-line, the following processes can be conducted automatically.
- Laser processing
- UV irradiate to BG tape
- Dicing tape mounting
- BG tape removal
- Dicing tape expansion
Wafer Dicing Machines:ML200
Feature
The MAHOHDICINGPrinciple
We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting excellent performance.
The ML200 uses multiphoton absorption - the optical damage phenomenon that occurs when the strength of laser light is radically increased - with laser light focused on the inner part of the material to be processed. By doing this an internal modification layer is formed, and this is used as the basic mechanism for separating chips. Put another way, wafers adhering to the dicing tape are irradiated by a laser, and through expansion of the dicing tape, wafer separation is conducted.
High Quality Processing
Dicing of thin wafers (30 µm) made possible
The ML200 makes high speed dicing (300 mm/s) of thin wafers possible.
Minimal Chipping
Chipping has been radically minimized.
Completely Dry Process
As a completely dry process is used, this processing technology is perfectly suited to devices averse to moisture, such as optical devices.
High Throughput
Dices 4 Times Faster than Blade Dicing
The ML200 is able to dice thin wafers of thickness 100 µm or thinner at a speed of 300 mm/s, contributing significantly to improved throughput.
Large Increases in Chip Yield
The kerf loss necessary for blade dicing has been reduced to 0 µm with ML200, and dramatic reduction in dicing street width has been made possible. This technology pushes chip yield per wafer to the maximum limit.
Comparison of Chip Surfaces
MAHOHDICING
Conventional blade dicing
Improved Yield
Improvements Made in Flexural Strength
As wafers are cut internally, avoiding any damage to the wafer surface,chipping on the bottom surface of the wafer is minimized, flexural strength is improved, and breaking strength when wafers are picked during the packaging process is improved, improving tact in the die bonder process as well as contributing to better yield.
Dices 4 Times Faster than Blade Dicing
The ML200 is able to dice thin wafers of thickness 100 µm or thinner at a speed of 300 mm/s, contributing significantly to improved throughput.
High Reliability
Equipped with Wafer Support Handling
When irradiating the reverse side with a laser, the wafer can be conveyed by support handling.
New and improved support frame handling
Safety Slide Cover
During laser irradiation, work can be performed safely by opening and closing the slide cover
Slide cover opened
Slide cover closed
Equipped with Inspection Stage
In the inspection process, which is indispensable to the dicing process, specific wafers can be taken off of the inspection stage automatically. Additionally, after inspection wafers can be returned to the stage and stored automatically in their original cassette slots.
Inspection stage, used for checking the results of dicing
Reduced Operations Costs
No Waste Water Disposal Required
When processed, the modification layer is formed within the Si, meaning that dust is radically reduced, and resources are not spent on waste water disposal costs.
No Blade Replacement Required
The ML200 does not use blades, meaning that blade costs are reduced, and labor is not required for blade replacement and quality control of blade wear and tear.
No Dicing Water Required
The process is completely dry, meaning that no DI water is used. As no contamination occurs, cleaning processes are also unnecessary.
Specifications
ML200 MAHOHDICING MACHINE Specifications
| Applicable Wafer Size | Circular Wafer: 2 to 8 inches diameter | |
|---|---|---|
| Applicable Frame Size | 5-inch to 8-inch diameter frame | |
| X-axis | Stroke | 419 mm |
| Cutting feed rate | 0.1 mm to 600 mm/sec | |
| Positioning resolution | 0.002 mm | |
| Straightness | 0.0015 mm / 210 mm (both horizontal and vertical) | |
| Y-axis | Stroke | 320 mm |
| Driving speed | 100 mm/sec max | |
| Positioning resolution | 0.0002 mm (closed-loop control) | |
| Positioning accuracy | 0.002 mm / 250 mm | |
| Z-axis | Stroke | 9 mm |
| Driving speed | 20 mm/sec max | |
| Positioning resolution | 0.0001 mm (closed-loop control) | |
| Positioning accuracy | 0.001 mm / 1 mm | |
| Power Supply | Supply voltage: Selected from 200/220/240/380/415 V AC ± 10% 3 phase, 50 to 60 Hz. | |
| Power consumption | 4.0 kVA max | |
| Compressed Air | Pressure: 0.5 to 0.7 MPa | |
| N2 Gas | Pressure: 0.5 to 0.7 MPa | |
| Thermal regulator for water for Laser cooling | Pressure: 0.2 to 0.5 MPa | |
| Dimensions | 1,520W × 1,290D × 1,900H mm | |
| Weight | 1,600 kg | |
ML200 MAHOHDICING MACHINE External View
Polish Grinder: PG300/PG200
PG300
PG200
The product of a unique ACCRETECH innovation, this Polish Grinder combines the wafer thinness required for IC cards and three-dimensional mounting technology with damage removal functions in a single device.
Feature 1
Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.
Feature 2
All the processes are completed without moving the wafer on the same chuck table.
Feature 3
The smallest footprint in the world
Feature 4
Environmental - friendly - subsurface damage reduction without chemicals.
Feature 5
System configuration
Polish Grinder: PG300RM/PG200RM
PG300 RM : For 300mm Wafers
PG200 RM : For 200mm Wafers
ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200.
Feature 1Optional RM module
The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames.
Feature 2
Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.
Feature 3
All the processes are completed without moving the wafer on the same chuck table.
Feature 4
The smallest footprint in the world.
Feature 5
Environmental - friendly - subsurface damage reduction without chemicals.
Feature 6
System configuration
ChaMP: For 300mm Wafers
Combining the technological expertise built up by Accretech in precision measuring equipment and semiconductor manufacturing equipment, we now offer "the ChaMP Series", the CMP systems compatible with 300 mm wafers, with process performance required by design rules for 90 nm and 32 nm devices, and able to keep up with the most advanced volume-production fabs.
Feature 1Air-float Head "Sylphide"
- Reference polishing is made possible via an air cushion that provides uniform pressure distribution.
- Wafer pressure is applied by an airbag independent of ring pressure, providing excellent low-pressure controllability and stability.
- Zone control is available.
Feature 2Edge Exclusion of 1 mm!
Feature 3Wafer Pressure Controllability & Repeatability
Feature 4Simple Maintenance for Polishing Heads - Ring Change
Demounting (approximately 5 seconds)
Slide the snap ring cover up with both hands
Spread the snap ring with your thumb (the retaining ring drops off)
Completely remove the retaining ring
Mounting (approximately 10 seconds)
- Grip the snap ring with both hands and push the retainer into the carrier. Rotate it slightly to align the faces where the positioning frame slips into place.
- Attach the snap ring round the whole circumference and slide the cover down.
ChaMP: For 150 or 200mm Wafers
For 150 or 200mm Wafers
Sliced Wafer Carbon Demounting and Cleaning Machine : C-RW-200/300
Feature 1
Automatic demounting of wafers from the slicing base, cleaning and storing into the cassette.
Wafer Edge Grinding: W-GM-5200
- Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.
- The non-contact measuring method achieves the stable alignment.
- Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.
- The modular concept to make the optimum process line possible.
- Low damage grinding method is available.
Feature 1
Machine specification ready for 300 mm and 200 mm wafer.
Feature 2
Visual system (optional) for measuring the chamfer width of periphery and notch.
Wafer Edge Grinding: W-GM-4200
- Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.
- The non-contact measuring method achieves the stable alignment.
- Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.
- The modular concept to make the optimum process line possible.
- Low damage grinding method is available.
Feature 1
Machine specification ready for 75 - 150 mm wafer or for 150 - 200 mm wafer.
Feature 2
Capable of various material processes, such as chemical compound semiconductor.
Wafer Slicing Machine: S-LM-116G
Precise slicing machine for fragile materials such as glass, ceramics, ferrite.
Feature 1
16"-size blade for easy handling, lifting and adjustment.
Feature 2
Open-structure loading unit for easy mounting of the workpiece.
Feature 3
Easy setting of slicing speed and wafer thickness with digital switch.
Feature 4
Strong frame, highly rigid table provides long-term stability in performance.
Feature 5
Easy coolant adjustment and dressing operation.
Wafer Slicing Machine: A-WS-100S
Scribes wafer substrate with high precision
Feature 1Easy alignment
With fine adjustment in horizontal and rotative directions
Feature 2Easy scribe setting
With the touch panel to set the index amount, number of times of scribing, etc.
Wafer Probing Machines: UF3000
Assimilating the up-to-date technologies such as originative OTS, QPU and TTG, this super high-spec system provides the testing system which meets your needs for the miniaturization of the next-generation devices and various testing environment.
Feature 1OTS - the newest positioning technology (Optical Target Scope)
OTS enables to measure the relative position of the cameras with absolute accuracy, which improved dramatically.
Based on the ACCRETECH metrology technology, OTS enables the self-correlation of the alignment optical system.
Feature 2QPU - super high-rigid chucking (Quad-Pod Unit)
To effectively attain the accuracy in positioning, the high rigidity of every part is greatly important.
The UF3000 uses the new technology of 4 axes driving mechanism (QPU) for Z-axis, enabling the high-rigid, stable probe contact.
Feature 3Load-port
Testing environment satisfying the users' needs is available by the common platform of 8-inch and 12-inch cassettes and the front allocation of the inspection tray. The machine is also ready for AMHS (Automated Material Handling System).
Feature 4TTG (Touch To Go)
Pursuing the easy operation, the UF3000 adopts the function to move to the position you touch on the map or image shown on the touch panel. Setting up is easy, and screen configuration is possible by the user definition.
Wafer Probing Machine: UF2000
Tokyo Seimitsu, now known as Accretech, has continued to lead the semiconductor industry as the world's number one manufacturer of wafer probing machines. The newly developed UF2000 high-precision 200mm wafer prober is designed for devices with decreasing pad pitches typified by LCD drivers and other such devices, and features enhanced functionality in all areas, while offering the same functions and operating ease as the previous model.
Feature 1
Achieves overall precision of ±1.5µm.
Feature 2
Adopts new processor, newly designed loader and image processing system with enhanced performance, dramatically boosting throughput.
Wafer Probing Machine: UF200A
Evolving and Proliferating Wafer Probing Machine, UF Series Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.
Feature 1
8-inch multipurpose machine.
Wafer Probing Machine: UF190B
Evolving and Proliferating Wafer Probing Machine, UF Series Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.
Feature 1
High-performance, high-throughput, and excellent cost performance machine.
Feature 2
The UF190A features the same high-performance and excellent operability as the UF200 earned a reputation including the automatic needle alignment function and the color LCD touch panel.
Wafer Probing Machine: FP200A
Evolving and Proliferating Wafer Probing Machine, UF Series Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.
Feature 1
Frame transfer ready for the thinner wafer.
Wafer Probing Machines Network: VEGANET
The operation status of the wafer probing machines can be centralizedly monitored to further improve the operation rate
System monitor
Operation rate control
Prober status monitor
Data analysis
Wafer Probing Machines Network: LIGHTVEGA
The resource control will be centralized on the user host
Wafer Probing Machines Network: GEM Network System
Wafer Probing Machines Network: VEGA PLANET
Dedicated terminals contributing to the efficiency enhancement of test areas
Feature 1
Device data compile terminal
Feature 2
Remote operation terminal
Feature 3
Logging data analysis terminal
Feature 4
Map viewer
