Feature 1

Automatic demounting of wafers from the slicing base, cleaning and storing into the cassette.

• Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.
• The non-contact measuring method achieves the stable alignment.
• Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.
• The modular concept to make the optimum process line possible.
• Low damage grinding method is available.

Feature 1

Machine specification ready for 300 mm and 200 mm wafer.

Feature 2

Visual system (optional) for measuring the chamfer width of periphery and notch.

• Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.
• The non-contact measuring method achieves the stable alignment.
• Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.
• The modular concept to make the optimum process line possible.
• Low damage grinding method is available.

Feature 1

Machine specification ready for 75 - 150 mm wafer or for 150 - 200 mm wafer.

Feature 2

Capable of various material processes, such as chemical compound semiconductor.

Precise slicing machine for fragile materials such as glass, ceramics, ferrite.

Feature 1

16"-size blade for easy handling, lifting and adjustment.

Feature 2

Open-structure loading unit for easy mounting of the workpiece.

Feature 3

Easy setting of slicing speed and wafer thickness with digital switch.

Feature 4

Strong frame, highly rigid table provides long-term stability in performance.

Feature 5

Easy coolant adjustment and dressing operation.

Scribes wafer substrate with high precision

Feature 1Easy alignment

With fine adjustment in horizontal and rotative directions

Feature 2Easy scribe setting

With the touch panel to set the index amount, number of times of scribing, etc.