Wafer dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
- Wafer Dicing Machines:A-WD-300TX
This has boosted productivity 1.3 times compared to the previous model, and provides an optimum level of reliability and performance, enabling this fully automatic dicing machine to handle the production of 300mm wafers.
- Wafer Dicing Machines:A-WD-200T
High throughput achieved by a new concept
The A-WD-200T uses an opposing, twin spindle arrangement. This unique concept minimizes motion and delivers a massive boost in throughput.
- Wafer Dicing Machines:A-WD-250S
Fully automated dicing machine for 8 inch wafer and large-sized substrates
- Wafer Dicing Machines: AD20T
Revolutionary axis design orientation creates the smallest twin spindle Dicing Saw
- Wafer Dicing Machines:A-WD-10B
This multipurpose dicing machine realizes ease of use with the adaptation of the much sought-after space saving factor, slide cover system and function
management system.
- Wafer Dicing Machines:PS280
Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible!
New connected handlers, shorten coordination time - bringing increased operation efficiency and substantial savings in processing time.
- Automatic Cleaning System:A-CS-100A
Stand-alone wafer cleaning unit, A-CS-100A will provide best solution for cleaning and drying the wafer such as sawn with semi-automatic dicing saws.
High-pressure water spray up to 10 MPa driven by horizontal swinging arm will achieve excellent cleaning quality.
- Wafer Dicing Machines:ML300
High performance laser dicing machine for 300 mm wafers with SDE.
- Wafer Dicing Machines:ML200
We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting excellent performance.
