Polish grinders simultaneously thin wafers while performing damage removal caused by the grinding process, and offer various applications for peripheral processes in the one system.
Polish Grinder: PG3000/PG200
PG3000
PG200
The product of a unique ACCRETECH innovation, this Polish Grinder combines the wafer thinness required for IC cards and three-dimensional mounting technology with damage removal functions in a single device.
Feature 1
Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.
Feature 2
All the processes are completed without moving the wafer on the same chuck table.
Feature 3
The smallest footprint in the world
Feature 4
Environmental - friendly - subsurface damage reduction without chemicals.
Feature 5
System configuration
Polish Grinder: PG3000RM/PG200RM
PG3000 RM : For 300mm Wafers
PG200 RM : For 200mm Wafers
ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200.
Feature 1Optional RM module
The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames.
Feature 2
Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.
Feature 3
All the processes are completed without moving the wafer on the same chuck table.
Feature 4
The smallest footprint in the world.
Feature 5
Environmental - friendly - subsurface damage reduction without chemicals.
Feature 6
System configuration
