Wafer Dicing Machines:PS280
Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible!
New connected handlers, shorten coordination time - bringing increased operation efficiency and substantial savings in processing time.
Feature
Twin Cutting-stage Mechanisms and Independent Microscope Drive Mechanism
The new parallel spindle drive shaft with an independent microscope drive shaft – make simultaneous cutting and alignment operations possible. This combines with PS280’s twin cutting stage mechanisms to bring unparalleled performance!
Large Cutting Area
PS280’s large cutting area ensures smooth scrap processing and easy maintenance (Patent pending).
Wide, Bright Image Processing
The optical system comes with a wider visual field and higher, brighter resolution – greatly assisting image processing during operations such as alignment. The results – reduced alignment error and shorter alignment time (Patent pending).
Specifications
| Items | PS280 |
|---|---|
| Applicable work size (Max) | 280 x 110 mm 215mm |
| Saw-jig size (Max) | φ312 mm |
| Spindle type | Mechanical bearing type |
| Spindle output power | 1.8 kW |
| Rotation speed (Max) | 30 min-1 |
| Blade size | 3 inches |
| X-axis cutting speed | 0.1～600 mm/sec (X1, X2, both axes) |
| Y1, Y2, and Microscope-axis stroke | 300mm (Y1, Y2, both axes) |
| Y1, Y2, and Microscope-axis positioning accuracy | 0.005/300 mm |
| Z1, Z2, and Focus-axis positioning accuracy | 0.003/1 mm |
| Theta-axis rotation range | 195° |
| Power supply | AC200~220V 3phase 50/60Hz |
| Air supply | 0.55~0.7 MPa 390 L/min |
| D.I.water supply | 0.4~0.5 MPa 12 L/min |
| Spindle cooling water | 0.2~0.5 MPa 3 L/min |
| Machine size (W x D x H mm) | 1600 x 1685 x 1760 mm |
