Wafer Dicing Machines: AD20T
Revolutionary axis design orientation creates the smallest twin spindle Dicing Saw
Feature
Foot print
The world’s smallest footprint. Footprint reduced 40% compared with Accretech’s existing machines.
High Throughput
Twin-spindle design. Substantially higher through-put resulting in lower CoO.
High Accuracy
Cutting quality is improved with the new design due to high rigidity and low vibration.
