Wafer Dicing Machines:A-WD-300TX
This has boosted productivity 1.3 times compared to the previous model, and provides an optimum level of reliability and performance, enabling this fully automatic dicing machine to handle the production of 300mm wafers.
Feature
Spindle rotation speed of 80,000 min-1 made possible
The spindle axis comes standard equipped with a newly developed 80,000 min-1 high speed spindle,a result of Tokyo Seimitsu's accumulated expertise in processing technology.
Tokyo Seimitsu is opening up a new domain in processing, with previously unattainable high-speed dicing and high processing quality.
(Patent pending)
X-axis travel speed of 1,000 mm per second attained. Industry first!
Through pursuing ever increasing speed for X-axis linear motors,we have achieved a travel speed of 1,000 mm /s, an industry first.
Increased high speed throughput has been achieved In the drive section, Tokyo Seimitsu uses a well-established air guide system that in combination with the linear motor forms a completely non-contact mechanism offering high processing quality with reduced vibration.
Cleaning time reduced by half with the triple air accelerated cleaning head. Industry first!
By reducing cleaning time to half that of conventional systems, transfer section waiting time has been greatly decreased.
The excellent cleaning results produced by the triple air accelerated cleaning head are particularly effective in eliminating contaminant deposits after slicing.
(Patent pending)
Contamination reduced with the water cleaning unit. Industry first!
Contaminant deposits created during dicing have been reduced with the water cleaning unit, equipped as standard.
(Patent pending)
Wafer does not drop even if air is cut-off .Industry first!
With the wafer protection system equipped in the transfer arm,even if air is cut-off, the wafer is prevented from dropping.
An adjustable speed stepping motor is used in the wafer contact section. Through use of this system stress placed on thin wafers and small chip wafers vulnerable to impact when detaching has been reduced, making highly reliable and stable transferring possible. (Patent pending)
RED-LED lighting, new model microscope adopted
Through use of RED-LED lighting and a new model microscope, wafer contrast and resolution as seen on the monitor have been significantly improved.
17-inch touch screen panel monitor employed
The monitor used has progressed forward to a touch panel system enabling intuitive operation.
Visibility and operability have been improved with a larger operation display.
Automation of software
We offer GUI (Graphic User Interface) based operations, emphasizing automation and simplification.
The complicated procedures and settings required by operators in conventional models have been done away with as much as possible, and the device itself makes judgments and actively assists with operations.
Improved error recovery functions and reduction in operation times have been made possible.
One microscope and optical cutter set unit per spindle
One high magnification microscope and optical cutter set unit is provided for each of the Z1 and Z2 spindles, shortening the time required for alignment, kerf checking and setting up, as well as increasing speed.
To prevent contaminant deposits, a mechanical cover has been provided for the microscope and optical cutter set unit.
Standard adoption of a pitch between blades of 25 mm
For small chip devices, high productivity can be maintained by reducing the pitch between blades.
By reducing the pitch between blades from the conventional figure of 34 mm to 25 mm, superior productivity is demonstrated with standard specifications.
Superior maintainability
An optimal device layout simplifies front and rear access, significantly improving maintainability.
USB interface adopted
A USB interface has been adopted enabling effective upgrading and storage of device data.
Specifications
A-WD-300TX Specifications
| Wafer size | Max. ΓΈ 310 mm | |
|---|---|---|
| Usable frame size | 8", 12" | |
| Spindle 1, 2 | Rated output | 1,200kW |
| Maximum speed | 80,000min-1 | |
| Static dicing accuracy | 0.004mm | |
| X axis | Feed rate range | 0.1 ~ 1,000mm/s |
| Y 1, 2 axis | Accuracy | 0.002mm/310mm |
| Control resolution | 0.0001mm | |
| Slicing range | 310mm | |
| Z 1, 2 axis | Accuracy | 0.003mm/1mm |
| Stroke resolution | 0.0002mm | |
| Repeatability precision | 0.0015mm | |
| Blade diameter | φ60mm | |
| θ axis | Control resolution | 0.3arc-s |
| Rotation angle | 720deg | |
| Power supply | AC 200 - 220 V, 3 phase, 50/60 Hz *Multiple power supply types supported with optional transformer |
|
| Air supply | Source pressure | 0.5 - 0.7 Mpa |
| Consumption | Average 250ℓ/min *Excludes air blow | |
| Nitrogen | Source pressure | 0.5 - 0.7 Mpa |
| Consumption | Average 100ℓ/min | |
| DI water for cutting | Source pressure | 0.4 - 0.5 Mpa |
| Consumption | Max. 12ℓ/min | |
| DI water for cleaning | Source pressure | 0.4 - 0.5 Mpa |
| Consumption | Max. 4ℓ/min | |
| Spindle coolant | Source pressure | 0.2 - 0.5 Mpa |
| Consumption | 3ℓ/min (Municipal water possible) | |
| Dimensions | 1,650W×1,420D×1,800Hmm *Excludes protruding parts |
|
| Weight | 1,800kg | |
Main Options
- Built-in UV curing unit
- Booster pump unit
- Forced exhaust fan
- Thermo regulator for Water
- Static eliminator
- Z-axis scale
- Adjustable light source color for microscope lighting
- 3-inch blade compliance
- Air accelerated cleaning unit for slicing section
- Melody alarm
- Barcode-based automatic device switching
- Utility cassette
- Frame vacuum clamp
- Production management system
- GEM networks communication
- Operation management system
- Multiple power supply compatible
- transformer
- Resistivity, temperature monitor
