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Wafer Dicing Machines

Wafer Dicing Machines:A-WD-10B

This multipurpose dicing machine realizes ease of use with the adaptation of the much sought-after space saving factor, slide cover system and function
management system.

Feature

  • The Z-axis drive unit encoder system stepping motor guarantees high accuracy and reliability, and the X- and Y- axis slide section has a high accuracy, high rigidity linear guide.
  • Simultaneous 2-axis control of X- and Y-axis and high throughput, with a max. speed of X-axis: 450mm/s, Y-axis: 80mm/s and Z- axis: 40 mm/s.
  • A conveniently-located compact operating panel, rubber switch and jog dial optimized to the operation type (one hand operation) are used; an LCD panel is also used.

Common usages

  • Electronic parts (SMD, HIC, Piezo device, etc)
  • Semiconductors (Si, GaAs, etc)
  • Glass (crystal, filter, small LCD, etc)
  • Thermal Head (Small), New Materials


The clarity of the microscope image and the accuracy of image recognition are improved by LED lighting.
(Ring lighting specification: Optional)


User-friendly Operating Panel


Operation Display


Function Management System
Registering frequently used functions and creating shortcuts improves operability.

Specifications

A-WD-10B Specifications

Work Size 162 × 162 mm
X axis Movement stroke 290 mm
Cutting speed 0.1 - 450 mm/s
Y axis Movement stroke 162 mm
Maximum speed 80 mm/s
Positioning accuracy 5 µm
Z axis Movement stroke 35 mm
speed 40 mm/s
Resolution 0.0001 mm
θ axis Rotation range 290°
Positioning resolution 0.00018°(0.648")
Alignment Microscope type Split-field type
Camera, LCD Standard (12.1" magnification 211 ×)
Spindle Type Air spindle with a built-in high-frequency AC motor
Maximum revs. 40,000 min-1
Maximum output 900W
Others Power supply 200/220V AC , 3 phase
Power consumption 2kVA
Air supply Air supply 0.55 - 0.6 MPa, 180ℓ/min
Spindle coolant water 0.2 - 0.5 MPa, 1.5ℓ/min
Cutting water 0.2 - 0.5 MPa, 5ℓ/min max
Equipment dimensions, weight 650 W × 890 D × 1,300 H mm, 500 kg

Main Options


A-CS-100A (Optional)

  • Non-contact optical cutter setting unit
  • Blade breakage detector
  • 3” flange compatibility
  • Y-scale positioning accuracy:2 µm/162 mm
  • Cover interlock
  • Ring lighting
  • Middle power spindle
  • 3 color indication lamp
  • Mist fan
  • CE marking
  • A-CS-100A (Spin Cleaner/Dryer)

Catalog Download

Wafer Dicing Machines:A-WD-10B Catalog(PDF:339KB)