Automatic Cleaning System:A-CS-100A
Stand-alone wafer cleaning unit, A-CS-100A will provide best solution for cleaning and drying the wafer such as sawn with semi-automatic dicing saws.
High-pressure water spray up to 10 MPa driven by horizontal swinging arm will achieve excellent cleaning quality.
Feature
- Maximum rotation speed of spinning table is up to 3,000 min-1
- Available frame size: 5 to 8”
- Cleaning method: High-pressure,Rinse, Air dry (Driven by swing arm)
Specifications
A-CS-100A Specifications
| Frame size capability | 5 to 8” |
|---|---|
| Spinning table speed | 30 to 3000min-1 |
| High-pressure cleaning | 30 to 10 MPa |
| Rinse water pressure | Less than 0.4 MPa |
| Drying air pressure | Less than 0.7 MPa |
| Facilities | |
| Power supply | AC 100V 50-60Hz (Single phase) |
| Power consumption | 500 VA (Max.) |
| Air supply | 0.5 to 0.7 MPa 200 NL / min |
| Water supply | 0.2 to 0.7 MPa 2L / min |
| Over-all dimension | 400Wx650Dx1076F |
| Over-all weight | 125 kg |
