ACCRETECH next generation systems support customers' optimum device productions.
Wafer Manufacturing System
Variety of products line for wafer manufacturers including Wafer Slicing Machine and Wafer Edge Grinding Machine.
CMP
CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
Wafer Probing Machines
Wafer probing machines perform electrical tests of each chip on a wafer, ensuring the quality of semiconductor devices.
Polish Grinders
Polish grinders simultaneously thin wafers while performing damage removal caused by the grinding process, and offer various applications for peripheral processes in the one system.
Wafer Dicing Machines
Wafer dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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