Semiconductor Manufacturing Equipment

Semiconductor Manufacturing Equipment

ACCRETECH next generation systems support customers' optimum device productions.

  • Dicing machine cut wafers into individual semiconductor chips with blades.
    ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
  • With the diamond, the world-hardest substance, super-abrasive grit,we offer the cutting blade and solution that are high quality and cost cutting.
  • Probing machines perform electrical tests of each chip on a wafer, ensuring the quality of semiconductor devices.
  • Polish grinders simultaneously thin wafers while performing damage removal caused by the grinding process, and offer various applications for peripheral processes in the one system.
  • High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials
  • CMPs remove unevenness on wafer surfaces that occur during the production process.
    Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
  • Variety of products line for wafer manufacturers including Sliced Wafer Demounting and Cleaning Machine and Wafer Edge Grinding Machine.

About Semiconductor Manufacturing Equipment

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