Semiconductor Manufacturing Equipment
SS30
Semi-Automatic
Blade
Φ300mm
Electronic Components
Single Spindle
Semiconductors
Semi-automatic dicing machine for Φ300mm wafers

SS30

The same high rigidity and gate type structure as in the fully automatic dicer are used. A stable cutting environment is provided by using a structure that is not easily affected by heat contraction or vibration. The maximum workpiece size is Φ 300 mm, and the square table specification can handle up to 300 mm x 250 mm square substrates. The use of our originally developed axial mechanism contributes to the speeding up of the X, Y, Z axes and the enhanced throughput. A 1.8 kW rating, high-output spindle is equipped as standard. A broad range of uses from silicon to electronic devices can be supported.

Features

Compact design, φ300mm wafer compatible dicing machine
A wide range of materials are supported, from silicon to difficult-to-cut materials. 
When the square table is selected from the special specification, processing of substrates up to 300 mm x 250 mm can also be supported. 

High-performance, high-output spindle equipped as standard
1.8 kW rating, maximum rotation speed of 60 krpm (a 2.2 kW rating high-torque spindle can also be equipped as an option)

Enhanced productivity (throughput) 
Increased rigidity + servomotorization of the X, Y, Z axes
Establishment of both a reduced footprint and high throughput

 High scalability (the standard specification supports various processing modes)
The feature with multiple workpiece support and an alignment corresponding to the state with multiple workpieces applied to 1 tape frame, and the feature in which the workpiece distortion is detected by the alignment treatment, and the cutting position (Y, θ) is corrected so that the optimal chip is obtained, etc., are equipped as standard. 
Software features required for various processing uses are equipped as standard, and a wide range are supported from silicon to electronic component processing. 

Operability
A 17-inch touch panel + GUI (Graphical User Interface) are used. 
Simply by touching the iconized buttons, straightforward and comfortable operation is achieved. 
The device is equipped with an operation system in common with the AD/SS Series whose use is familiar.

Specifications

Maximum work size Φ 300 mm, 300 mm×250 mm
Spindle Number of rotations 60,000 rpm
Maximum blade diameter Φ 2 to 3 inch (Φ 60 to 80 mm)
Rating output 1.8kW
X axis Cuttable range 310mm
Fastest speed 800mm/sec
Y axis Cuttable range 310mm
Fastest speed 300mm/sec
Z axis Cumulative precision 0.002mm/310mm
Stroke 35mm
Fastest speed 80mm/sec
Repeatability 0.001mm
Θ axis Rotation range 380°
Specifications Voltage 3 Phase AC200 to 220 V ±10% (Other than the above, compatible with a transformer)
Consumed electric power 4.0 kVA(MAX)
Air supply pressure 0.55 to 0.7 MPa
Average consumed volume of air 180 L/min (at 0.55 MPa)
Cutting water, other (pressure) 0.3 to 0.5 MPa
Cutting water, other (maximum flow rate) 2.0 L/min
Cooling water (pressure) 0.3 to 0.5 MPa
Cooling water (maximum flow rate) 1.9 L/min (at 0.3 MPa)
Exhaust flow rate 5 ㎥/min or more
Dimensions (W x D x H) 890mm×1,000mm×1,560mm
Weight 800kg

Maintenance

Large access area is secured

Large access area is secured