Dicing Machines

Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.

  • Tokyo Seimitsu Dicing Machine realizes the remarkable “CoO (Cost of Ownership)” by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date technology.
  • Achieved smallest footprint possible utilizing our own core technology.
  • Revolutionary axis design orientation creates the smallest twin spindle Dicing Saw
  • Fastest and smallest 6-inch dicing machine.
    Improved operability with the 17-inch touch panel screen.
    The image-processing engine accommodates variety of work.
  • 8-inch dicing machine
    Small footprint with highly stable structure.
    Compliant with the large work
  • 12-inch dicing machine
    Small footprint with highly stable structure.
    Compliant with varieties of work
  • Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible! New connected handlers, shorten coordination time - bringing increased operation efficiency and substantial savings in processing time.
  • 12-inch laser dicing machine with wafer handling system achieved high performance to respond to various customer’s needs.
  • Stand-alone wafer cleaning unit, A-CS-300 provides best solution for cleaning and drying the wafer cut by semi-automatic dicing saws. Air accelerated water nozzle and horizontal swing arm achieves excellent cleaning quality.

About Semiconductor Manufacturing Equipment

Contact Us / Request for Brochures