Semiconductor Manufacturing Equipment
AD2000T/S
Fully Automatic
Blade
Φ200mm
Electronic Components
Single/Twin Spindle
Semiconductors
Fully automatic dicing machine for Φ200mm wafers

AD2000T/S*

*Spindle equipped specification T(Twin): opposing type 2-axis spindle specification, S(Single): 1-axis spindle specification
The device inherits the design platform of the Φ 300mm compatible machine, the AD3000T-PLUS. The opposing type 2-axis spindles are arranged diagonally, to achieve both a reduced space design and high maintainability. The use of our originally developed axial mechanism contributes to the speeding up of the X, Y, Z axes and the enhanced throughput. A 1.8 kW rating, high-output spindle is equipped as standard. A broad range of dicing uses from electronic devices to power semiconductors, etc. can be supported.

Features

Reduced space design
This is an originally developed diagonal layout design. Everything from normal operation to maintenance is accessible from the front. 
When multiple units are installed in a line, since the lateral surface maintenance area can be reduced, 5 units of the AD2000T can be installed in the installation space for 4 units of the conventional devices. 

 Reduced space design

Enhanced productivity (throughput)
Waste-free processing is achieved with an opposing type 2-axis spindle design and the minimum required X movement.
X axis speed: 1,000 mm/sec, Y axis speed:  300 mm/sec, Z axis speed: 80 mm/sec
Servomotors are used for all the X, Y, Z axes to speed up the axis speed
A reduction in processing time is achieved through optimization of the control software + synchronous control of the 3 axes
Two optical cutter-set (common name: OPC) units are mounted as standard. Reduction of the standby time by simultaneous set-up

High-performance, high-output spindle equipped as standard
1.8 kW rating, maximum rotation speed of 60 krpm (a 2.2 kW rating, high-torque spindle can also be mounted as an option)
Processing of a wide range of materials is supported, from silicon to difficult-to-cut materials. 

操作性

Operability
A 17-inch touch panel + GUI (Graphical User Interface) are used. 
Simply by touching the iconized buttons, straightforward and comfortable operation is achieved. 

Plenty of optional settings
Intermediate dress feature, built-in UV irradiation system, barcode reader automatic recipe switching feature, ionizer, etc.
The major optional units can be built-in due to the smaller footprint of the optional units and the optimized internal design

OOver 10,000 recipes storable

USB port as standard
(USB memory device can be used as external memory)

Optimized vacuum controller
Reduces 50% of air consumption compared with existing model

Specifications

Maximum work size Φ 200 mm
Spindl Layout T(TWIN):Opposing 2-axis spindle
S(Single):1-axis spindle
Rated output 1.8 kW
Maximum Rotation   60,000 rpm
X axi Cuttable range 260 mm
Fastest speed 1000 mm/s
Y1/Y2 axis Cuttable range 260 mm
Fastest speed 300 mm/s
Control resolution 0.078 μm
Cumulative precision 0.002 mm/210 mm
Z1/Z2 axis Stroke 34 mm
Resolution 0.002 μm
Fastest speed 80 mm/sec
Repeatability 0.001 mm
Θ axis Rotation range 380°
Specifications Voltage 3 Phase AC200 to 220 V ±10%
(Other than the above, compatible with a transformer)
Consumed electric power 6.0 kVA (MAX)
Air supply pressure 0.55 to 0.7 MPa
Average consumed volume of air 210 L/min (at 0.55 MPa)
Cutting water, other (pressure) 0.3 to 0.5 MPa
Cutting water, other (maximum flow rate) Cutting water: 10.0 L/min
Other: 3.6 L/min
Cooling water (pressure) 0.3 to 0.5 MPa
Cooling water (maximum flow rate) 3.4 L/min (at 0.3 MPa)
Exhaust flow rate 5.0 m³/min more
Dimensions (W x D x H) 1080 mm x 1190 mm x 1900 mm
Weight   1100 kg

Note:
・The air consumption amount in the table and the consumption flow rate of the cutting water and the cooling water are the values for AD2000T/S. 
・This specification may be changed without notice for the purpose of improvements.

Maintenance

Maintenance

The large door and processing space increased the maintainability.