Semiconductor Manufacturing Equipment
Metal Bond Blade : YM/AM Series
Dicing
Cutting
Blade
Alumina
AlN
The YM/AM Series enables high quality cutting of AIN, SIN, and high purity AI203.

Metal Bond Blade : YM/AM Series

Features

Metal blade series specialized in the ceramics cutting

Higher rigidity than the resin blade allows better straightness and higher-speed cutting

Higher wear resistance than the resin blade enables longer life time

YM/AMシリーズ 特長

Processing Target

Various types of glass

Various types of electronic substrates

Ceramics

Processing Example

Alumina substrate LED cutting (AM Series)

AM series holds the sharp cutting performance for providing the vertical cutting capability to resolve a protrusion issue in segmentation process beyond the cutting ability of conventional metal blade.

アルミナ基板LEDの切断(AMシリーズ)

LTCC cutting (YM Series)

Improved cutting ability has realized the cutting without chipping and cracking even for thick LTCC.
YM030 is used. 

LTCC cutting (YM Series)

AI2O3 substrate

AI2O3 substrate

SiN substrate

SiN substrate