Features
Pursued the reduction of chipping and high speed cutting
A unique plating technology provides for even distribution of the grit and performance stability
Extensive lineup can meet the variety of demands
By combining, it can cope with variety of cutting, from the step cutting to the full cutting
Specifications
Specification and notation
Type
Bond
Availability by grit size
Dimension notation and standard
Processing Target (and Processing Example)
Silicon
SiC
LT/LN
Other types of compound wafers, etc.
Backside chipping (silicon wafer)
Saw mark (silicon wafer)
Blade surface after processing
LCDD cutting example
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