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Sales of “A-WD-300TX” Next-Generation High-Speed Dicing Machine Commence

Tokyo Seimitsu Co., Ltd. (President, CEO & COO: Sadakatsu Suzuki) is exhibiting the A-WD-300TX at its booth (Small No. 5A-1009) at “Semicon Japan 2005”, and has begun selling this next-generation high-speed dicing machine.

The A-WD-300TX inherits the opposing-type spindle system developed by Accretech, incorporates a newly developed 80,000 rpm high-speed spindle, and features an X axis drive with a high movement speed of 1,000 mm per second. This has boosted productivity 1.3 times compared to the previous model, and provides an optimum level of reliability and performance, enabling this fully automatic dicing machine to handle the production of 300mm wafers.

A-WD-300TX Features

  1. Triple air acceleration cleaning heads have reduced cleaning time by approximately 1/2 (industry first).
  2. Standard provision of water cleaning unit reduces contamination during dicing process (industry first).
  3. Wafer protection system incorporated on transport arm prevents wafer from being dropped in the unlikely event air supply is interrupted (industry first).
  4. Adoption of red LED light and new type of microscope dramatically improve contrast and resolution when wafer is viewed on monitor screen.