The more compact size of mobile phones in recent years combined with 3D packaging in digital cameras and memory cards has led to an increasing demand for thinner chips, with the requirement for chip thickness now approaching 30 microns. This has made the market for thin wafer devices nearly exceed the market for back grinders, and it is expected to continue to increase in size.

The PG200/300RM polish grinders are capable of making wafers thinner and removing damage at the same time. In addition, these units can perform multiple processes, including removal of the surface protective tape applied to the thin wafer and mounting the wafer on the dicing frame. Our polish grinders have been recognized by customers as the de-facto standard in processing thin wafers, securing a 90 percent market share, with sales in 2004 forecast to increase by over 60 percent compared to the previous year.

The MAHOHDICING MACHINE developed jointly with Hamamatsu Photonics K.K. is a revolutionary unit that uses a new type of laser dicing system, eliminating any damage to the wafer surface and the necessity of washing or blades. It is ideally suited to the efficient dicing of thin silicon wafers, serving a vital role in the thin wafer manufacturing process, along with our polish grinders. Process development and evaluation with users have recently been completed, resulting in the commencement of shipment of the machine. We expect sales to increase this year.

I. Features of PG200/300RM

1. Performs rear polishing of wafer, polishing process, tape removal and tape demounting in a single unit.
2. Integration of processes with wafer mounted on same chuck table maximizes yield.

II. Features of MAHOHDICING MACHINE

1. Capable of performing dicing without any chipping.
2. No heat is generated during dicing since no blades are used. This enables high-speed cutting.
3. The process is completely dry, eliminating the necessity of washing.
4. The pitch is narrow and cutting efficiency is high.