TOKYO SEIMITSU begins sales of "MAHOHDICING MACHINE", Revolutionary Laser Dicing Machine
TOKYO SEIMITSU CO., LTD. (Hideo Ohtsubo, Chairman & C.E.O.) begins sales of the "MAHOHDICING MACHINE", a radical new type of laser dicing machine co-developed with Hamamatsu Photonics K.K. The machine can be seen in action at SEMICON Japan 2003 (from Dec.3), at the Tokyo Seimitsu booth (No.5-A901).
"MAHOHDICING MACHINE" employs world breakthrough technology. The machine irradiates the inside section of the silicon wafer, forming and vertically building up modification layer, to separate chips. This totally innovative dicing process was born of a fusion of Tokyo Seimitsu's high precision measuring technology and semiconductor manufacturing equipment technology, with the stealth dicing technology of Hamamatsu Photonics K.K. It enables high speed dicing of ultra thin wafers far superior to conventional blade dicing technology. It also gives significant savings in time and cost by using a completely dry process. Also, unlike other conventional laser processing methods (heat processing, ablation processing), chipping as well as damaging effects from the heating process are totally eliminated, enabling a clean dicing operation.
Main features
- World's 1st - cut 30 micron meter silicon wafers by non-contact method totally eliminating surface damage. ("MAHOHDICING MACHINE" enables dicing of thin wafers, where conventional blade dicers have difficulty cutting under 50 micron meter wafers.)
- High speed dicing of 300mm per second, 5 times faster than conventional blade dicers.
- Enables increase in chips per wafer by almost zero kerf loss, less than 1 micron meter.
- Complete dry process with no cleaning requirement.
- List price: JPY120,000,000- (200mm type)
- Sales targets: (FY2004) several units, (FY2005) over10 units
