New UF300A 300 mm Wafer Compatible Prober with Superior Rigidity and High Throughput has been Released
Tokyo Seimitsu (Hideo Ohtsubo, Chairman & CEO) has announced the release of its newly developed ACCRETECH UF300A 300 mm wafer compatible prober. The new wafer prober was exhibited at SEMICON West 2001 (*1), held from July 16 to 20.
This new machine's predecessor, the UF300, was the first 300 mm wafer compatible prober. Since its 1997 release by Tokyo Seimitsu, it has been delivered to a number of companies for use in pre-production lines, mainly for the purpose of R&D and evaluation analysis.
Many 300 mm wafer mass production plants are now starting up in the market. Against this background, Tokyo Seimitsu has developed the UF300A prober as the next-generation 300 mm wafer compatible machine suitable for mass production.
Major features include:
- New Tripod wafer chuck that is 50% more rigid than the conventional UF300 to allow for over 128 test sites and pin counts exceeding 9000 pins.
- Ultra low noise chuck for parametric testing below 0.2pA.
- GEM300 Compliant Interface
- Large size cleaning stage & dual brushes for greater selection of cleaning options.
- 20% higher throughput achieved with newly enhanced graphics vision system, improved mechanism, and highly tuned software.
- Automated remote control capability that can be used with any standard PC system located anywhere outside of the factory clean room.
The market is moving from 200 mm to 300 mm wafer compatible probers. Tokyo Seimitsu will actively promote the advanced UF300A 300 mm wafer compatible probers to mass production plants to meet this demand.
- Shipment to begin : July 2001
- Major specifications: Overall accuracy : Within 4 µm
- Stage positioning accuracy :2µm/φ300mm
*1 The machine was exhibited at the San Jose exhibition hall where Test, Assembly & Packaging process products were exhibited.
