Dedicated High Precision Wafer Thickness Measuring System

Feature
Feature 1
For various wafer sizes: Models are available to measure the thickness of φ3, φ4, φ5, φ6 and φ12 wafers.
Feature 2
Easy to operate: changes between different wafer sizes can be performed by simply changing the position of the stopper pin.
Feature 3
Moire Scale Provides 0.1 µm Min. Resolution, repeatability of 0.2 µm and a highly precise cumulative indication error of ±0.15 µm
Feature 4
The lift lever incorporates a printout command switch. This enables data to be printed as soon as measurement has been completed.
Catalog Download
Dedicated High Precision Wafer Thickness Measuring System Catalog(PDF:151KB)![]()

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