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High Precisions Digital Measurement Instrument

Dedicated High Precision Wafer Thickness Measuring System

Feature

Feature 1

For various wafer sizes: Models are available to measure the thickness of φ3, φ4, φ5, φ6 and φ12 wafers.

Feature 2

Easy to operate: changes between different wafer sizes can be performed by simply changing the position of the stopper pin.

Feature 3

Moire Scale Provides 0.1 µm Min. Resolution, repeatability of 0.2 µm and a highly precise cumulative indication error of ±0.15 µm

Feature 4

The lift lever incorporates a printout command switch. This enables data to be printed as soon as measurement has been completed.

Catalog Download

Dedicated High Precision Wafer Thickness Measuring System Catalog(PDF:151KB)

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