History

The winds of change-our DNA precipitates innovation

40' 1949 Tokyo Seimitsu Kogu Co., Ltd. is established Appoints Kozo TOJIMA as chairman 東京精密工具(株)
50' 1950 Appoints Gonzo ISAHAYA as chairman
1951 Commences manufacture and sale of measuring machines using mechanical gauges
1953 Develops Japan's first flow type air micrometer 日本初高圧流量式空気マイクロメーター
1955 Appoints Makoto TAKAGI as chairman
1957
  • Develops Japan's first LVDT type electric micrometer Establishes
  • Daiichi Seiki Co., Ltd.
1958 Develops Japan's first germanium pellet auto-sorter 世界初ゲルマニウムペレット厚さ自動選別機
60' 1962
  • Renames the Company as Tokyo Seimitsu Co., Ltd.
  • Stock is listed on the Tokyo Stock Exchange 2nd Section
  • Develops surface texture measuring instrument
1963
  • Develops Japan's first wafer slicing machine Opens Hachioji Plant
1964 Develops first wafer probing machine in Japan Commences sales of turn-key plant and production technology for electric and air micrometers to China 1964年1967年
1967 Develops cylindrical form measuring instruments
1969
  • Establishes Tosei Engineering Service Co., Ltd.
  • Opens Tsuchiura Plant
  • Develops Japan's first coordinate measuring machine
  • evolution_6_1
  • evolution_6_2
  • evolution_6_3
70' 1970 Develops wafer dicing machine
80' 1980 Appoints Akira MIURA as chairman
1985 Establishes Tosei Systems Co., Ltd. jointly with CEC as a software development group
1986
  • Stock is listed on the Tokyo Stock Exchange 1st Section
  • ppoints Goro IMAZAWA as chairman
1987 Establishes Research Laboratory
1988 Appoints Shozaburo KARUBE as chairman
1989 Establishes TOKYO SEIMITSU EUROPE GmbH (GERMANY) and TOKYO SEIMITSU AMERICA, INC. (USA)
90' 1992
  • Appoints Hideo OHTSUBO as chairman
  • Acquires Silicon Technology Corporation (STC) of the United States
  • Establishes TSK Service Center in Korea
  • Renames Daiichi Seiki Co., Ltd. as Micro Technologies Co., Ltd.
 
1994
  • ISO 9001 certification is awarded to the Hachioji and Tsuchiura Plants
  • Hachioji Plant attains business license under the traceability system of the Measurement Law for the calibration of the "length measurement laser"
  • Establishes Beijing Representative Office is established
  • Establishes TOKYO SEIMITSU (MALAYSIA) SDN. BHD.
計量法トレーサビリティ制度に基づく長さ測定用レーザの校正認定事業者
1995
  • Tsuchiura Plant attains business license under the traceability system of the Measurement Law for the calibration of the "block gauge"
  • Sets up Sanmenxia Zhongyuan Tokyo Seimitsu Co., Ltd. as a joint venture enterprise with Zhongyuan Measuring Instrument Co., Ltd. of China
  • Establishes TSK AMERICA, INC. and TSK MANUFACTURING COMPANY in the United States
  • Enters into partnership with Carl Zeiss in the field of high precision measuring instruments
  • Concludes licensing agreement with Kulicke and Soffa Industries, Inc. of the United States for the sale of dicing machines
計量法トレーサビリティ制度に基づく端度器(ブロックゲージ)の校正認定事業者
1996
  • Receives "10 BEST Award" for "Customer satisfaction with a semiconductor equipment supplier" (Survey by VLSI Research Inc.)
  • Establishes TSK Technical Center in Hsinchu, Taiwan
  • Establishes TOKYO SEIMITSU (ISRAEL) LTD.
半導体製造装置サプライヤー顧客満足度調査(VLSIリサーチ社調べ)で10 BEST賞を受賞
1997
  • Opens New Nagoya Plant of Tosei Engineering
  • Receives "10 BEST Award" for 2nd consecutive year
  • Establishes TOKYO SEIMITSU (SINGAPORE) PTE. LTD.
  • Integrates U.S. subsidiaries into TSK AMERICA, INC.
1998
  • Hachioji and Tsuchiura plants obtain ISO 14001 certification
  • Receives "10 BEST Award" for 3rd consecutive year
ISO 14001の認証取得
1999
  • Inaugurates new head office of Tosei Engineering in Tsuchiura
  • Reorganizes MICRO TECHNOLOGIES CO., LTD. into TSK MICRO TECHNOLOGIES CO., LTD. to support the development, manufacture and sale of wafer inspection systems
  • Establishes TSK FINANCE CO., LTD.
  • Receives "10 BEST Award" for 4th consecutive year
  • Initiates business partnership for wire saws and related devices with HCT of Switzerland
  • Unveils New symbol mark at SEMICON Japan
 
00' 2000
  • Signs sole Japanese dealership contract for 3D vision systems with CogniTens of Israel
  • Receives "10 BEST Award" for 5th consecutive year
  • Establishes LEEPL Corp. with U.S. company Nanolith, L.L.C. and ANGEL Labs Corp.
  • Develops wafer inspection system
  • Develops world's first polish grinder
 
2001
  • Introduces corporate brand "ACCRETECH"
  • Opens new Hachioji Main Plant Building
  • Receives "10 BEST Award" for 6th consecutive year
  • Establishes LEEPL Technology Consortium
  • Establishes TSK Box Corp.
  • Establishes TSK MICRO TECHNOLOGIES KOREA CO., LTD.
  • Tosei Engineering Corporation stock is listed on the Tokyo Stock Exchange 2nd Section
  • 新しいシンボルマークをセミコンジャパン'99にて発表
  • (株)東精エンジニアリング、東京証券取引所市場第二部に株式上場
2002
  • Introduces Executive Officer System and In-House Company System at Semiconductor Company, Metrology Company and Administration Company
  • Establishes ACCRETECH (CHINA) CO., LTD., an affiliated company in China
  • Renames TSK MICRO TECHNOLOGIES CO., LTD. as ACCRETECH MICRO TECHNOLOGIES CO., LTD.
  • Renames TSK FINANCE CO., LTD. as ACCRETECH FINANCE CO., LTD.
  • Renames TSK AMERICA, INC. as ACCRETECH USA, INC.
  • Renames TOKYO SEIMITSU (MALAYSIA) SDN. BHD. as ACCRETECH (MALAYSIA) SDN. BHD.
  • Renames TOKYO SEIMITSU (ISRAEL) LTD. as ACCRETECH (ISRAEL) LTD.
  • Renames TOKYO SEIMITSU (SINGAPORE) PTE. LTD. as ACCRETECH (SINGAPORE) PTE. LTD.
  • Renames TSK MICRO TECHNOLOGIES KOREA CO., LTD. as ACCRETECH MICRO TECHNOLOGIES KOREA CO., LTD.
  • Receives "10 Best Award" in two categories: Test & Material Handling Equipment category (7th consecutive year) and Assembly Equipment category (first time)
  • Develops next-generation wafer inspection systems in conjunction with Hitachi High Technologies Corp.
  • Jointly develops new laser dicing equipment, MAHOHDICING MACHINE, for semiconductor manufacturing equipment market, together with Hamamatsu Photonics K.K.
  • Develops Chemical Mechanical Planarizer (CMP)
中国に現地法人東精精密設備(上海)有限公司設立
CMP装置
2003
  • Separates Roles of Chairman & C.E.O. and President & C.O.O.
  • Appoints Hideo OHTSUBO as Chairman & C.E.O.
  • Appoints Sadakatsu SUZUKI as President & C.O.O.
  • Receives "10 BEST Award" in two categories: Test & Material Handing Equipment category (8th consecutive year), Assembly Equipment category (2nd consecutive year; ranked No.1)
  • Develops E-beam lithography system
ポリッシュグラインダ
2004
  • Receives "10 BEST Award" in two categories: Test & Material
  • Handing Equipment category (9th consecutive year), Assembly
  • Equipment category (3rd consecutive year; ranked No.1)
 
2005
  • New Semiconductor Plant Hachioji Completed
  • New Measuring Instrument Plant in Tsuchiura Completed
  • Receives "10 BEST Award" in two categories: Test & Material Handing Equipment category (10th consecutive year), Assembly Equipment category (4th consecutive year; ranked No.1)
  • Sadakatsu SUZUKI, President & C O O, named President C E O & C O O
  • Hideo OHTUBO, former Chairman and present Principal Adviser, became the first foreigner to be bestowed the title of Honorary Adviser of the CSIA(China Semiconductor Industry Association)
  • Renewed partnership agreement with Carl Zeiss for another 5 years
 
2006
  • Receives "10 BEST Award" in two categories
  • Test & Material Handing Equipment category (11th consecutive year),
  • Assembly Equipment category (5th consecutive year; ranked No.1)
  • Released "UF3000EX" that supports the last generation of 300mm Wafer prober.
 UF3000EX
2007
  • Establishment of Accretech Korea Co., Ltd.
  • MAHOH DICING MACHINE was granted the Chairman' Award of The Japan Machinery Federation at its 27th JMF Award for Energy-Conserving Machinery.
  • Received the "10 BEST Awards" in two categories:
    awarded for 12 consecutive years in the Test & Material Handing Equipment category, and for 6 consecutive years in the Assembly Equipment category
  • Obtained a business license at Tsuchiura Plant under the traceability system of the Measurement Law for the calibration of the "length measurement laser" and "3D Coordinate Measuring Machine"
  • Separation of roles of C E O & C O O
  • Kazuo FUJIMORI named C O O
 
2008
  • Recieved the "10 BEST Awards" in two categories:
  • awarded for 13 consecutive years in the Test & Material Handing Equipment category, and for 7 consecutive years in the Assembly Equipment category
  • Technical cooperation with Mitaka Kohki Co., Ltd in non-contact metrology
 
2009
  • Establishment of Tokyo Seimitsu USA Branch
  • Appointment of Mr. Kazuo FUJIMORI as CEO.
 
2010
  • Establishment of Tokyo Seimitsu USA Branch
 
2011
  • Appointment of Mr. Kunimasa OTA as CEO.
  • Started mass-production of "AD3000T/S" of the world's smallest and fastest dicing machine in the most advanced semiconductor line.
  • Establishment of the local corporation, Tokyo Seimitsu (Thailand) Co., Ltd..
 AD3000T/S
2012
  • Establishment of "ACCRETECH Application Center" corresponding to the diversification of the device process.
  • Began manufacturing, development and sales upon "the acquisition of precision blade business" from Mitsubishi Materials.
  • Opened the representative office Tokyo Seimitsu Co., Ltd. Indonesia.
 
2013
  • Establishment of the local corporation, ACCRETECH Vietnam Co.,.
  • Released non-contact sensor "Opt-measure."
 Optmeasure光センサ
2014
  • Released Non-contacted/three-dimensional surface roughness and contour measuring instrument "Opt-scope."
 
2015
  • Appointment of Mr. Hitoshi YOSHIDA as CEO.