• Develops Japan's first LVDT type electric micrometer Establishes Daiichi Seiki Co., Ltd.

• Renames the Company as Tokyo Seimitsu Co., Ltd.
• Stock is listed on the Tokyo Stock Exchange 2nd Section
• Develops surface texture measuring instrument

• Develops Japan's first wafer slicing machine Opens Hachioji Plant

• Develops first wafer probing machine in Japan Commences sales of turn-key plant and production technology for electric and air micrometers to China

• Establishes Tosei Engineering Service Co., Ltd.
• Opens Tsuchiura Plant
• Develops Japan's first coordinate measuring machine

• Stock is listed on the Tokyo Stock Exchange 1st Section
• ppoints Goro Imazawa as chairman

• Establishes TOKYO SEIMITSU EUROPE GmbH (GERMANY) and TOKYO SEIMITSU AMERICA, INC. (USA)

• Appoints Hideo Ohtsubo as chairman
• Acquires Silicon Technology Corporation (STC) of the United States
• Establishes TSK Service Center in Korea
• Renames Daiichi Seiki Co., Ltd. as Micro Technologies Co., Ltd.

• ISO 9001 certification is awarded to the Hachioji and Tsuchiura Plants
• Hachioji Plant attains business license under the traceability system of the Measurement Law for the calibration of the "length measurement laser"
• Establishes Beijing Representative Office is established
• Establishes TOKYO SEIMITSU (MALAYSIA) SDN. BHD.

• Tsuchiura Plant attains business license under the traceability system of the Measurement Law for the calibration of the "block gauge"
• Sets up Sanmenxia Zhongyuan Tokyo Seimitsu Co., Ltd. as a joint venture enterprise with Zhongyuan Measuring Instrument Co., Ltd. of China
• Establishes TSK AMERICA, INC. and TSK MANUFACTURING COMPANY in the United States
• Enters into partnership with Carl Zeiss in the field of high precision measuring instruments
• Concludes licensing agreement with Kulicke and Soffa Industries, Inc. of the United States for the sale of dicing machines

• Receives "10 BEST Award" for "Customer satisfaction with a semiconductor equipment supplier" (Survey by VLSI Research Inc.)
• Establishes TSK Technical Center in Hsinchu, Taiwan
• Establishes TOKYO SEIMITSU (ISRAEL) LTD.

• Opens New Nagoya Plant of Tosei Engineering
• Receives "10 BEST Award" for 2nd consecutive year
• Establishes TOKYO SEIMITSU (SINGAPORE) PTE. LTD.
• Integrates U.S. subsidiaries into TSK AMERICA, INC.

• Hachioji and Tsuchiura plants obtain ISO 14001 certification
• Receives "10 BEST Award" for 3rd consecutive year

• Inaugurates new head office of Tosei Engineering in Tsuchiura
• Reorganizes MICRO TECHNOLOGIES CO., LTD. into TSK MICRO TECHNOLOGIES CO., LTD. to support the development, manufacture and sale of wafer inspection systems
• Establishes TSK FINANCE CO., LTD.
• Receives "10 BEST Award" for 4th consecutive year
• Initiates business partnership for wire saws and related devices with HCT of Switzerland
• Unveils New symbol mark at SEMICON Japan

• Signs sole Japanese dealership contract for 3D vision systems with CogniTens of Israel
• Receives "10 BEST Award" for 5th consecutive year
• Establishes LEEPL Corp. with U.S. company Nanolith, L.L.C. and ANGEL Labs Corp.
• Develops wafer inspection system
• Develops world's first polish grinder

• Introduces corporate brand "ACCRETECH"
• Opens new Hachioji Main Plant Building
• Receives "10 BEST Award" for 6th consecutive year
• Establishes LEEPL Technology Consortium
• Establishes TSK Box Corp.
• Establishes TSK MICRO TECHNOLOGIES KOREA CO., LTD.
• Tosei Engineering Corporation stock is listed on the Tokyo Stock Exchange 2nd Section

• Introduces Executive Officer System and In-House Company System at Semiconductor Company, Metrology Company and Administration Company
• Establishes ACCRETECH (CHINA) CO., LTD., an affiliated company in China
• Renames TSK MICRO TECHNOLOGIES CO., LTD. as ACCRETECH MICRO TECHNOLOGIES CO., LTD.
• Renames TSK FINANCE CO., LTD. as ACCRETECH FINANCE CO., LTD.
• Renames TSK AMERICA, INC. as ACCRETECH USA, INC.
• Renames TOKYO SEIMITSU (MALAYSIA) SDN. BHD. as ACCRETECH (MALAYSIA) SDN. BHD.
• Renames TOKYO SEIMITSU (ISRAEL) LTD. as ACCRETECH (ISRAEL) LTD.
• Renames TOKYO SEIMITSU (SINGAPORE) PTE. LTD. as ACCRETECH (SINGAPORE) PTE. LTD.
• Renames TSK MICRO TECHNOLOGIES KOREA CO., LTD. as ACCRETECH MICRO TECHNOLOGIES KOREA CO., LTD.
• Receives "10 Best Award" in two categories: Test & Material Handling Equipment category (7th consecutive year) and Assembly Equipment category (first time)
• Develops next-generation wafer inspection systems in conjunction with Hitachi High Technologies Corp.
• Jointly develops new laser dicing equipment, MAHOHDICING MACHINE, for semiconductor manufacturing equipment market, together with Hamamatsu Photonics K.K.
• Develops Chemical Mechanical Planarizer (CMP)

• Separates Roles of Chairman & C.E.O. and President & C.O.O.
• Appoints Hideo Ohtsubo as Chairman & C.E.O.
• Appoints Sadakatsu Suzuki as President & C.O.O.
• Receives "10 BEST Award" in two categories: Test & Material Handing Equipment category (8th consecutive year), Assembly Equipment category (2nd consecutive year; ranked No.1)
• Develops E-beam lithography system

Receives "10 BEST Award" in two categories: Test & Material Handing Equipment category (9th consecutive year), Assembly Equipment category (3rd consecutive year; ranked No.1)

• New Semiconductor Plant Hachioji Completed
• New Measuring Instrument Plant in Tsuchiura Completed
• Receives "10 BEST Award" in two categories: Test & Material Handing Equipment category (10th consecutive year), Assembly Equipment category (4th consecutive year; ranked No.1)
• Sadakatsu Suzuki, President & C O O, named President C E O & C O O
• Hideo Ohtsubo, former Chairman and present Principal Adviser, became the first foreigner to be bestowed the title of Honorary Adviser of the CSIA(China Semiconductor Industry Association)
• Renewed partnership agreement with Carl Zeiss for another 5 years

Receives "10 BEST Award" in two categories: Test & Material Handing Equipment category (11th consecutive year), Assembly Equipment category (5th consecutive year; ranked No.1)

• Establishment of Accretech Korea Co., Ltd.
• MAHOH DICING MACHINE was granted the Chairman' Award of The Japan Machinery Federation at its 27th JMF Award for Energy-Conserving Machinery.
• Received the "10 BEST Awards" in two categories:
  awarded for 12 consecutive years in the Test & Material Handing Equipment category, and for 6 consecutive years in the Assembly Equipment category
• Obtained a business license at Tsuchiura Plant under the traceability system of the Measurement Law for the calibration of the "length measurement laser" and "3D Coordinate Measuring Machine"
• Separation of roles of C E O & C O O
• Kazuo Fujimori named C O O