Progressing hand-in-hand with a diverse array of peoples, Tokyo Seimitsu prides itself on its ability to leverage technology, knowledge and information to create the world's premier products. This unchanging philosophy is personified in our new corporate brand, ACCRETECH, which combines the words ACCRETE, meaning "to grow and fuse together" and TECHNOLOGY. We seek to gather global, cutting-edge technologies across organization, country and region, to overcome challenges and precipitate growth. We are confident that our new corporate structure, embodied by our metamorphosis into ACCRETECH, will drive development in the 21st century.
ACCRETECH Technologies In Society
We have been developing a wide range of precision measuring systems for over a half century based on the concept that nothing can be created without means of measurement.
No product will be released to the market before it is subject to the measurement processes in the design, manufacturing and inspection phases and thus checked for its safety, performance stability, environmental compatibility, and design quality.
Our measuring systems not only constitute the business basis of our company but also support the social infrastructures. We believe that our continued effort to provide high precision systems will support the ongoing requirements in the manufacturing industry: More safety, more convenience, and less environmental load.
The automotive industry is a major user of our measuring systems. The automotive manufactures have been addressing a challenging target - What must be done to manufacture high-performance and eco-friendly automotive products at a lower cost. Because of this background, we have picked up the automotive manufacturing process as the first topic for explaining how our products contribute to the industrial development.
Environment-Oriented Semiconductor Manufacturing Equipment: Laser Dicing Machine: MAHOHDICING MACHINE
We believe that our mission as the developer and provider of the ACCRETECH products is to contribute to environmental preservation by developing environment-oriented products.
As a result of such efforts, we have recently released a totally new wafer dicing machine that the world has never seen before. The machine cuts a silicon wafer by radiating a laser beam to the inside of the wafer and thus developing modified layers vertically.
Along with the design technologies exploiting the advantage of this technical solution, the waterless laser dicing machine achieves high-speed dicing even for an ultra thin wafer with a thickness under 100μm. The following paragraph offers more details.
Environment-oriented features:
| Blade dicing AWD-200T/300T |
Laser dicing ML 200/300 | Reduction rate | ||
|---|---|---|---|---|
| Power consumption rate per throughput | ||||
| Power consumption (@200V) |
3.2kWh | 1.92kWh | 0.48kWh | 85% |
| Ultrapure water consumption | 12 litter/min | - | 100% | |
| Equivalent power consumption (assumption) | 0.028kw/min | - | - | |
| Total power consumption (per hour) | 4.87kWh | 1.92kWh | 0.48kWh | 90% |
The new laser dicing machine requires no ultrapure water, and the power consumption is no more than 1.92kWh. Furthermore, it achieves a substantially higher throughput than the conventional blade dicing machines, reducing the manufacturing time to almost one-fourth.
Therefore, in terms of the power consumption per throughput, the laser dicing machine offers up to 85% energy saving in comparison with the blade dicing machines.
If you count the power consumption required for creating ultrapure water, the resultant energy saving effect amounts to 90% in total.
This will also contribute to the energy saving and cost reduction in cutting waste disposal.
User industry:
ncorporating a breakthrough laser technology, the machine offers an appropriate solution for the contemporary needs in the semiconductor manufacturing, that is, the ability to process an ultra-thin wafer.
- Cellular phone, SD card
- IC card
